Breakthrough ball attach technology by introducing solder paste screen printing von Chin, Y.T., Khor, C.K., Sow, H.P., Ooi, S.J., Tan, H.B.

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Total effective surface area principle for enhancement of capacitive humidity sensor of thick-film nanoporous alumina von Chung, C.K., Khor, O.K., Kuo, E.H., Ku, C.A.

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Sensitivity evolution and enhancement mechanism of porous anodic aluminum oxide humidity sensor using magnetic field von Chen, S.W., Khor, O.K., Liao, M.W., Chung, C.K.

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Effect of oxalic acid concentration on the magnetically enhanced capacitance and resistance of AAO humidity sensor von Chung, C.K., Khor, O.K., Syu, C.J., Chen, S.W.

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Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation von Ong, Ernest E.S., Abdullah, M.Z., Khor, C.Y., Loh, W.K., Ooi, C.K., Chan, R.

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Analysis of encapsulation process in 3D stacked chips with different microbump array von Ong, Ernest E.S., Abdullah, M.Z., Khor, C.Y., Loh, W.K., Ooi, C.K., Chan, R.

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Enhancement of pore size distribution in one-step hybrid pulse anodization of aluminum thin films sputtered on Si substrates von Chung, C.K., Liao, M.W., Khor, O.K., Chang, H.C.

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Numerical Modeling and Analysis of Microbump Pitch Effect in 3D IC Package with TSV During Molded Underfill (MUF) von Ong, Ernest E.S., Abdullah, M.Z., Khor, C.Y., Leong, W.C., Loh, W.K., Ooi, C.K., Chan, R.

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Corporate governance in family run business – a Malaysian case study von Ponnu, Cyril H., Lee, C.K., Tan, Geron, Khor, T.H., Leong, Adelyn

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