A simple model for the Mode I popcorn effect for IC packages with copper leadframe von Alpern, P., Kheng Chooi Lee, Dudek, R., Tilgner, R.

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Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation von Chan, Marvin, Tan, Cher Ming, Lee, Kheng Chooi, Tan, Chuan Seng

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Moisture-Induced Delamination in Plastic Encapsulated Microelectronic Devices: A Physics of Failure Approach von Alpern, P., Kheng Chooi Lee

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Effects of Copper Migration on the Reliability of Through-Silicon Via (TSV) von Chan, Jiawei Marvin, Lee, Kheng Chooi, Tan, Chuan Seng

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Visual Vignette von Ratnasingam, Jeyakantha, Chooi, Kheng Chiew, Samsuddin, Syahrizan, Paramasivam, Sharmila, Ibrahim, Luqman, Lim, Lee Ling, Tan, Alexander, Vethakkan, Shireene

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What Does SGLT2 Inhibition Add in Managing Hyponatremia Secondary to Syndrome of Inappropriate Antidiuresis (SIAD)? von Jalal, Fadzliana Hanum, Ibrahim, Luqman, Lim, Quan Hziung, Chooi, Kheng Chiew, Rajendran, Santhanaruben, Ratnasingam, Jeyakantha, Paramasivam, Sharmila Sunita, Vethakkan, Shireene Ratna, Lim, Lee-Ling

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