Dielectric reliability of 70nm pitch air-gap interconnect structures von Pantouvaki, Marianna, Sebaai, Farid, Kellens, Kristof, Goossens, Danny, Vereecke, Bart, Versluijs, Janko, Van Besien, Els, Caluwaerts, Rudy, Marrant, Koen, Bender, Hugo, Moussa, Alain, Struyf, Herbert, Beyer, Gerald P.

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Thermal and plasma treatments for improved (sub-)1 nm equivalent oxide thickness planar and FinFET-based replacement metal gate high-k last devices and enabling a simplified scalab... von Veloso, Anabela, Boccardi, Guillaume, Ragnarsson, Lars-Åke, Higuchi, Yuichi, Arimura, Hiroaki, Lee, Jae Woo, Simoen, Eddy, Cho, Moon Ju, Roussel, Philippe J., Paraschiv, Vasile, Shi, Xiaoping, Schram, Tom, Chew, Soon Aik, Brus, Stephan, Dangol, Anish, Vecchio, Emma, Sebaai, Farid, Kellens, Kristof, Heylen, Nancy, Devriendt, Katia, Dekkers, Harold, Van Ammel, Annemie, Witters, Thomas, Conard, Thierry, Vaesen, Inge, Richard, Olivier, Bender, Hugo, Athimulam, Raja, Chiarella, Thomas, Thean, Aaron, Horiguchi, Naoto

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Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora ® LK HM von Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, Roest, David De, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P.

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Dielectric Reliability of 50 nm Half Pitch Structures in Aurora ® LK von Demuynck, Steven, Kim, Honggun, Huffman, Craig, Darnon, Maxime, Struyf, Herbert, Versluijs, Janko, Claes, Martine, Vereecke, Guy, Verdonck, Patrick, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Roest, David De, Sprey, Hessel, Beyer, Gerald

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Integration of Vertical Carbon Nanotube Bundles for Interconnects von Chiodarelli, Nicoló, Kellens, Kristof, Cott, Daire J., Peys, Nick, Arstila, Kai, Heyns, Marc, De Gendt, Stefan, Groeseneken, Guido, Vereecken, Philippe M.

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Dielectric reliability of 70 nm pitch air-gap interconnect structures von Pantouvaki, Marianna, Sebaai, Farid, Kellens, Kristof, Goossens, Danny, Vereecke, Bart, Versluijs, Janko, Van Besien, Els, Caluwaerts, Rudy, Marrant, Koen, Bender, Hugo, Moussa, Alain, Struyf, Herbert, Beyer, Gerald P.

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Thermal and plasma treatments for improved (sub-)1nm equivalent oxide thickness planar and FinFET-based replacement metal gate high-k last devices and enabling a simplified scalabl... von Veloso, Anabela, Boccardi, Guillaume, Ragnarsson, Lars-Ake, Higuchi, Yuichi, Arimura, Hiroaki, Lee, Jae Woo, Simoen, Eddy, Cho, Moon Ju, Roussel, Philippe J, Paraschiv, Vasile

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Use of MIR-FTIR and k-value Measurements to Assess Potential Solutions to Reduce Damage During Porous Low-k Integration von Beynet, Julien, De Roest, David, Rochat, Nevine, Kellens, Kristof, Verdonck, Patrick, Sprey, Hessel

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Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\text{\textregistered LK HM von Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, De Roest, David, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P

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Integration of Vertical Carbon Nanotube Bundles for Interconnects von Chiodarelli, Nicolo, Kellens, Kristof, Cott, Daire J., Peys, Nick, Arstila, Kai, Heyns, Marc M., De Gendt, Stefan, Groeseneken, Guido, Vereecken, Philippe M.

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Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK von Demuynck, S., Kim, H., Huffman, C., Darnon, Maxime, .Struyf, H., Versluijs, J., Claes, M., Vereecke, G., Verdonck, P., Volders, H., Heylen, N., Kellens, K., de Roest, D., Sprey, H., Beyer, G.

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Cu/Low-k Thickness Measurement for Advanced Cu CMP Process Development and Control von Li, Yunlong, Heylen, Nancy, Delande, Tinne, Kellens, Kristof, Ong, Patrick, Leunissen, Leonardus, Tarnowka, Alexandre, Eliyahu, Aviv

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CMP process optimization for improved compatibility with advanced metal liners von Heylen, Nancy, Li Yunlong, Kellens, Kristof, Carbonell, Laureen, Volders, Henny, Santoro, Gaetano, Gravey, Virginie, Cockburn, Andrew, Yuchun Wang, Shah, Kavita, Leunissen, Leonardus, Beyer, Gerald P, Tokei, Zsolt

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Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations von Carbonell, L., Volders, H., Heylen, N., Kellens, K., Caluwaerts, R., Devriendt, K., Sanchez, E.A., Wouters, J., Gravey, V., Shah, K., Luo, Q., Sundarrajan, A., Jiang Lu, Aubuchon, J., Ma, P., Narasimhan, M., Cockburn, A., Tokei, Z., Beyer, G.P.

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How origin, packaging and seasonality determine the environmental impact of apples, magnified by food waste and losses von Goossens, Yanne, Berrens, Paulien, Custers, Kristof, Van Hemelryck, Steven, Kellens, Karel, Geeraerd, Annemie

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Correction to: How origin, packaging and seasonality determine the environmental impact of apples, magnified by food waste and losses von Goossens, Yanne, Berrens, Paulien, Custers, Kristof, Van Hemelryck, Steven, Kellens, Karel, Geeraerd, Annemie

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How origin, packaging and seasonality determine the environmental impact of apples, magnified by food waste and losses von Goossens, Yanne, Berrens, Paulien, Custers, Kristof, Van Hemelryck, Steven, Kellens, Karel, Geeraerd, Annemie

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