Participant Anxiety and Presence of Hyperfunction in Stroboscopy von Kelkar, Amit S., Cox, Kathleen T., Hough, Monica, Ball, Laura, OʼBrien, Kevin

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International society on thrombosis and haemostasis disseminated intravascular coagulation scoring system: Is it a good prognostic indicator in DIC von Nisal, Amit, Nimbargi, Ravindra, Shelke, Parineeta, Kelkar, Anjali

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Do we think alike? A cross-cultural study of executive functioning von Kelkar, Amit S., Hough, Monica S., Fang, Xiangming

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Efficacy and safety of a nano-emulsion gel formulation of adapalene 0.1% and clindamycin 1% combination in acne vulgaris: a randomized, open label, active-controlled, multicentric,... von Prasad, Siva, Mukhopadhyay, Amiya, Kubavat, Amit, Kelkar, Amit, Modi, Ajay, Swarnkar, Bhavesh, Bajaj, Bobby, Vedamurthy, Maya, Sheikh, Shafiq, Mittal, Ravindra

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Mass Transfer and Solubility of CO and H2 in Ionic Liquid. Case of [Bmim][PF6] with Gas-Inducing Stirrer Reactor von Sharma, Amit, Julcour, Carine, Kelkar, Ashutosh A, Deshpande, Raj M, Delmas, Henri

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Mass Transfer and Solubility of CO and H 2 in Ionic Liquid. Case of [Bmim][PF 6 ] with Gas-Inducing Stirrer Reactor von Sharma, Amit, Julcour, Carine, Kelkar, Ashutosh A., Deshpande, Raj M., Delmas, Henri

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Anaesthetic management of Mowat-Wilson syndrome von Deshmukh, Amit, Kelkar, Kalpna, Khedkar, Sunita, Gavali, Yogesh

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Supra-sellar tubercular abscess von Agrawal, Amit, Mudkanna, Anand, Rudrakshi, SS, Kelkar, GP, Joshi, VijayP

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Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer von Kelkar, Amit, Sridharan, Vivek, Tran, Khanh, Ikeuchi, Kiyoko, Srivastava, Anu, Khandekar, Viren, Agrawal, Ricky

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Warpage compensation metal for wafer level packaging technology von Kelkar, Amit S, Muthukumar, Sriram, Sridharan, Vivek S

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Three-dimensional chip-to-wafer integration von Kelkar, Amit S, Thambidurai, Karthik, Khandekar, Viren, Nguyen, Hien D

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Development and System Analysis of a Two-Dimensional Rotational Freeplay Nonlinearity Model von Asjes, David, Diwadkar, Amit, Vaidya, Umesh, Kelkar, Atul

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Fan-out and heterogeneous packaging of electronic components von Tran Khanh, Parvarandeh Pirooz, Kelkar Amit S, Samoilov Arkadii V

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Wafer-level thin chip integration von SRIDHARAN VIVEK S, KELKAR AMIT S

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Bonded stacked wafers and methods of electroplating bonded stacked wafers von YING XUEJUN, ZOU QUANBO, SRIDHAR UPPILI, KELKAR AMIT S

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Wafer-level passive device integration von HARPER PETER R, THAMBIDURAI KARTHIK, KHANDEKAR VIREN, KELKAR AMIT S

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THREE-DIMENSIONAL CHIP-TO-WAFER INTEGRATION von THAMBIDURAI KARTHIK, NGUYEN HIEN D, KHANDEKAR VIREN, KELKAR AMIT S

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Three-dimensional chip-to-wafer integration von THAMBIDURAI KARTHIK, NGUYEN HIEN D, KELKAR AMIT SUBHASH, KHANDEKAR VIREN

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Wafer-level package device having high-standoff peripheral solder bumps von NGUYEN HIEN D, KHANDEKAR VIREN, KELKAR AMIT S

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BONDED STACKED WAFERS AND METHODS OF ELECTROPLATING BONDED STACKED WAFERS von YING XUEJUN, ZOU QUANBO, SRIDHAR UPPILI, KELKAR AMIT S

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