Neuropeptide Y mediates glucocorticoid-induced osteoporosis and marrow adiposity in mice von Wang, F.-S., Lian, W.-S., Weng, W.-T., Sun, Y.-C., Ke, H.-J., Chen, Y.-S., Ko, J.-Y.

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Associations between serum 25-hydroxyvitamin D levels and allergic sensitization in early childhood von Guo, Y., Yu, L., Deng, Y.-H., Ke, H.-J., Wu, J.-L.

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Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials von Li, C. C, Drymiotis, F, Liao, L. L, Hung, H. T, Ke, J. H, Liu, C. K, Kao, C. R, Snyder, G. J

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Phase field microelasticity model of dislocation climb: Methodology and applications von Ke, J.H., Boyne, A., Wang, Y., Kao, C.R.

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Surface textured ZnO:Al thin films by pulsed DC magnetron sputtering for thin film solar cells applications von Yen, W.T., Lin, Y.C., Ke, J.H.

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Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates – A simulation study von Ke, J.H., Gao, Y., Kao, C.R., Wang, Y.

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Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip von Chang, W.R., Chen, C.A., Ke, J.H., Lin, T.F.

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Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing von Huang, T.C., Yang, T.L., Ke, J.H., Li, C.C., Kao, C.R.

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Saturated flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip von Lie, Y.M., Ke, J.H., Chang, W.R., Cheng, T.C., Lin, T.F.

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Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn von Li, C.C., Ke, J.H., Yang, C.A., Kao, C.R.

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Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing von Ke, J.H., Yang, T.L., Lai, Y.S., Kao, C.R.

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Designing a toxic-element-free Ti-based amorphous alloy with remarkable supercooled liquid region for biomedical application von Lin, H.C., Tsai, P.H., Ke, J.H., Li, J.B., Jang, J.S.C., Huang, C.H., Haung, J.C.

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Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing von Ke, J.H., Chuang, H.Y., Shih, W.L., Kao, C.R.

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Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon von Tsai, S-L, Ke, H-Z, Ke, J-H, Huang, F-Y, Yan, B-H

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Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints von Tsai, M. Y., Lin, Y. L., Lin, Y. W., Ke, J. H., Kao, C. R.

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A model to study the disc degeneration process von NATARAJAN, R. N, KE, J. H, ANDERSSON, G. B. J

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Effect of post-annealing on the optoelectronic properties of ZnO:Ga films prepared by pulsed direct current magnetron sputtering von Yen, W.T., Lin, Y.C., Yao, P.C., Ke, J.H., Chen, Y.L.

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Fabrication of new composite abrasive for jet machining and application to scrap wafer regeneration von Ke, J-H, Tsai, F-C, Hung, J-C, Yang, T-Y, Yan, B-H

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Advantages of nitrogen fertilizer deep placement in greenhouse gas emissions and net ecosystem economic benefits from no-tillage paddy fields von Liu, T.Q., Li, S.H., Guo, L.G., Cao, C.G., Li, C.F., Zhai, Z.B., Zhou, J.Y., Mei, Y.M., Ke, H.J.

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Coating thickness effect of metallic glass thin film on the fatigue-properties improvement of 7075 aluminum alloy von Tsai, P.H., Li, T.H., Hsu, K.T., Ke, J.H., Jang, J.S.C., Chu, J.P.

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