Chemical-mechanical polishing for fabricating patterned W metal features as chip interconnects von KAUFMAN, F. B, THOMPSON, D. B, BROADIE, R. E, JASO, M. A, GUTHRIE, W. L, PEARSON, D. J, SMALL, M. B

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Investigating Slurry transport beneath a wafer during chemical mechanical polishing processes von COPPETA, J, ROGERS, C, RACZ, L, PHILIPOSSIAN, A, KAUFMAN, F. B

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Copper interconnection integration and reliability von Hu, C.-K., Luther, B., Kaufman, F.B., Hummel, J., Uzoh, C., Pearson, D.J.

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Analysis of flow between a wafer and pad during CMP processes von Rogers, C., Coppeta, J., Racz, L., Philipossian, A., Kaufman, F. B., Bramono, D.

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Ion and electron transport in stable, electroactive tetrathiafulvalene polymer coated electrodes von Kaufman, F. B, Schroeder, A. H, Engler, E. M, Kramer, S. R, Chambers, J. Q

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The Controlled Etching of Silicon in Catalyzed Ethylenediamine‐Pyrocatechol‐Water Solutions von Reisman, A., Berkenblit, M., Chan, S. A., Kaufman, F. B., Green, D. C.

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Thermomechanical deformation of 1 μm thick Cu-polyimide line arrays studied by scanning probe microscopy von ZHMURKIN, D. V, GROSS, T. S, BUCHWALTER, L. P, KAUFMAN, F. B

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Wettability of polished silicon oxide surfaces von THOMAS, R. R, KAUFMAN, F. B, KIRLEIS, J. T, BELSKY, R. A

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Spectra of tetracyanoquinodimethane monovalent anion: vibrational structure and polarization of electronic transitions von Haller, Ivan, Kaufman, F. B

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Formation of highly conducting organic salts by photooxidation of heterofulvalene .pi.-donors in halocarbon solutions von Scott, B. A, Kaufman, F. B, Engler, E. M

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Electrochemical preparation and control of stoichiometry for donor-halide salts: TTFXn and TSeFXn von Kaufman, F. B, Engler, E. M, Green, D. C, Chambers, J. Q

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Voltammetry and potentiometry of tetrathiafulvalene halides von Chambers, J. Q, Green, D. C, Kaufman, F. B, Engler, E. M, Scott, B. A, Schumaker, R. R

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Optical properties of charge transfer salts of tetracyanoquinodimethane (TCNQ) von Torrance, J.B., Scott, B.A., Kaufman, F.B.

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Optical properties of the radical cation tetrathiafulvalenium (TT F + ) in its mixed-valence and monovalence halide salts von Torrance, J. B., Scott, B. A., Welber, B., Kaufman, F. B., Seiden, P. E.

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Analysis of flow between a wafer and pad during CMP processes : Special section on chemical-mechanical planarization von ROGERS, C, COPPETA, J, RACZ, L, PHILIPOSSIAN, A, KAUFMAN, F. B, BRAMONO, D

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Optical properties of charge transfer salts of tetracy anoquinodimethane (TCNQ) von TORRANCE, J. B, SCOTT, B. A, KAUFMAN, F. B

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Copper interconnection integration and reliability: Copper-based metallizationand interconnects for ultra-large-scale integration applications von HU, C.-K, LUTHER, B, KAUFMAN, F. B, HUMMEL, J, UZOH, C, PEARSON, D. J

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Chemical-Mechanical Polishing for Fabricating Patterned Tungsten Metal Features as Chip Interconnects von Kaufman, F B, Jaso, M A, Pearson, D J, Small, M B, Thompson, D B, Broadie, R E, Guthrie, W L

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Polymer-modified electrodes: a new class of electrochromic materials von Kaufman, Frank B., Schroeder, Albert H., Engler, Edward M., Patel, Vishnu V.

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Molecular criteria of solid-state structure in organic charge-transfer salts. 2. Effect of methyl substitution on stacking interactions of p-phenylenediamine cation radicals von Kaufman, Frank B

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