Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails von Sakuma, Katsuyuki, Pancoast, Leanna, Yao, Yiping, Knickerbocker, John

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Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction von Sakuma, Katsuyuki, Abrami, Avner, Blumrosen, Gaddi, Lukashov, Stanislav, Narayanan, Rajeev, Ligman, Joseph W., Caggiano, Vittorio, Heisig, Stephen J.

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Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing von Blumrosen, Gaddi, Sakuma, Katsuyuki, Rice, John Jeremy, Knickerbocker, John

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Effects of Excimer Irradiation Treatment on Thermocompression Au--Au Bonding von Unami, Naoko, Sakuma, Katsuyuki, Mizuno, Jun, Shoji, Shuichi

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Simplified 20- mu m pitch vertical interconnection process for 3D chip stacking von Sakuma, Katsuyuki, Nagai, Noriyasu, Saito, Mikiko, Mizuno, Jun, Shoji, Shuichi

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Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack von Matsumoto, Keiji, Ibaraki, Soichiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kikuchi, Hidekazu, Orii, Yasumitsu, Yamada, Fumiaki

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Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements von Matsumoto, K., Ibaraki, S., Sueoka, K., Sakuma, K., Kikuchi, H., Orii, Y., Yamada, F.

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Investigations of cooling solutions for three-dimensional (3D) chip stacks von Matsumoto, Keiji, Ibaraki, Soichiro, Sato, Masaaki, Sakuma, Katsuyuki, Orii, Yasumitsu, Yamada, Fumiaki

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New Three-Dimensional Wafer Bonding Technology Using the Adhesive Injection Method von Takuji Matsumoto, Takuji Matsumoto, Masakazu Satoh, Masakazu Satoh, Katsuyuki Sakuma, Katsuyuki Sakuma, Hiroyuki Kurino, Hiroyuki Kurino, Nobuaki Miyakawa, Nobuaki Miyakawa, Hikotaro Itani, Hikotaro Itani, Mitsumasa Koyanagi, Mitsumasa Koyanagi

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3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System von Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama

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Effects of Vacuum Ultraviolet Surface Treatment on the Bonding Interconnections for Flip Chip and 3-D Integration von Sakuma, K, Mizuno, J, Nagai, N, Unami, N, Shoji, S

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Simplified 20-µm pitch vertical interconnection process for 3D chip stacking von Sakuma, Katsuyuki, Nagai, Noriyasu, Saito, Mikiko, Mizuno, Jun, Shoji, Shuichi

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CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling von Sakuma, Katsuyuki, Hu, Huan, Liu, Xiao Hu, Ni, Jiamin, Bedell, Stephen W., Webb, Bucknell, Wright, Steven L., Lauro, Paul, Latzko, Ken, Agno, Marlon, Tornello, James, Knickerbocker, John U.

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Fabrication and Performance of 300 mm Wafer Scale Silicon Microchannel Cooler von Colgan, Evan G., Schleupen, Kai, Mann, Phillip, Kuder, Robert, Nah, Jae-Woong, Sakuma, Katsuyuki, Alvarez, Victor, Turlapati, Lavanya, Wong, Danny, Lukashov, Stanislav, Cordes, Steve, Speidell, James

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SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING von Sakuma, Katsuyuki

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Solder transfer integrated circuit packaging von Sakuma, Katsuyuki

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SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING von Sakuma, Katsuyuki

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A New Wafer Scale Chip-on-Chip (W-COC) Packaging Technology Using Adhesive Injection Method von Kurino, Hiroyuki, Lee, Kang Wook, Sakuma, Katsuyuki, Nakamura, Tomonori, Koyanagi, Mitsumasa

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Development of vacuum underfill technology for a 3D chip stack von Sakuma, Katsuyuki, Kohara, Sayuri, Sueoka, Kuniaki, Orii, Yasumitsu, Kawakami, Mikio, Asai, Kazuo, Hirayama, Yoshikazu, Knickerbocker, John U

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Development of Three-Dimensional Integration Technology for Highly Parallel Image-Processing Chip von Wook Lee, Kang, Tae Park, Tomonori Nakamura, Yoon Kim, Hiroaki Shimazutsu, Hiroyuki Kurino, Hiroyuki Kurino, Mitsumasa Koyanagi, Mitsumasa Koyanagi

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