Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic von Rajkumar, Katepogu, Reddy, G． Umamaheswara

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Design of Cu-MWCNT Based Heterogeneous Coaxial through Silicon Vias for High-Speed VLSI Applications von Rajkumar, Katepogu, Reddy, G. Umamaheswara

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Conditional spatial transition reduction data encoding technique for VLSI interconnects von Snehalatha, J., Nannepaga, Chintaiah, Medasani, Sivasubramanyam, Nannepaga, Bujjibabu, Rajkumar, Katepogu

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Low power and compact architecture of sector transition reduction encoding technique von Latha, J. Sneha, Nannepaga, Chintaiah, Rajkumar, Katepogu, Nannepaga, Bujjibabu, Andhe, Kranthi Kumar

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Design and modeling of novel TSV for ternary logic applications von Rajkumar, Katepogu, Umamaheswara Reddy, G.

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Performance comparison between copper and carbon nanotube based TSV for 3D-integrated circuits von Rajkumar, Katepogu, Umamaheswara Reddy, G.

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Polymer Liners with Cu-MWCNT based HCTSVs to Reduce Crosstalk Effects von Katepogu Rajkumar, G. Umamaheswara Reddy

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