Temperature stable Pd ohmic contacts to p-type 4H-SiC formed at low temperatures von Kassamakova, L., Kakanakov, R.D., Kassamakov, I.V., Nordell, N., Savage, S., Hjorvarsson, B., Svedberg, E.B., Aborn, L., Madsen, L.D.

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Computer models for adjustment of fiber-optic refractometers for concentration measurement of sugar solutions von Onkov, K.Z., Kassamakov, I.V.

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Scanning white light interferometry in quality control of single-point tape automated bonding von Kassamakov, Ivan Vl, Seppänen, Henri O., Oinonen, Markku J., Hæggström, Edward O., Österberg, J. Mathias, Aaltonen, Juha P., Saarikko, Heimo, Radivojevic, Zoran P.

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Bonding quality monitoring applying statistical modeling of Scanning White Light Interferometry data von Schäfer, Robert, Seppänen, Henri, Kassamakov, Ivan, Hæggström, Edward, Hautpmann, Peter

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Selecting a Proper Microsphere to Combine Optical Trapping with Microsphere-Assisted Microscopy von Liu, Xi, Hu, Song, Tang, Yan, Xie, Zhongye, Liu, Junbo, He, Yu

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Experimental and numerical investigations of the texture evolution in copper wire drawing von Narayanan, Karthic R., Sridhar, I., Subbiah, S.

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Microlens‐assisted microscopy for biology and medicine von Trukhova, Anna, Pavlova, Marina, Sinitsyna, Olga, Yaminsky, Igor

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Wire bonding using copper wire von Zhong, Z.W

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Wire bonding of low-k devices von Zhong, Z.W

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Fine and ultra-fine pitch wire bonding: challenges and solutions von Zhong, Z.W

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Wire bonding using insulated wire and new challenges in wire bonding von Zhong, Z.W

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