True Temperature Measurement of Electronic Components Using Infrared Thermography von Kallis, J.M., Samuels, A.H., Stout, R.P.

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True Temperature Measurement of Electronic Components Using Infra-red Thermography von Kallis, J.M., Samuels, A.H., Stout, R.P.

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Reliability of the 3-D computer under stress of mechanical vibration and thermal cycling von Kallis, J.M., Duncan, L.B., Laub, S.P., Little, M.J., Miani, L.M., Sandkulla, D.C.

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Fracture mechanics life prediction for microscale components, with application to wire bonding von Harris, D.O., Sire, R.A., Popelar, C.F., Kanninen, M.F., Davidson, D.L., Duncan, L.B., Kallis, J.M., Buechler, D.W., Backes, P.G., Reizman, F.

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Combustion, gaseous emissions and PM characteristics of Di-Methyl Carbonate (DMC)-gasoline blend on gasoline Direct Injection (GDI) engine von Chan, J.H., Tsolakis, A., Herreros, J.M., Kallis, K.X., Hergueta, C., Sittichompoo, S., Bogarra, M.

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