Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density von Kadoguchi, Takuya, Sakai, Tsubasa, Sei, Tsubasa, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

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Electromigration Phenomenon in Solder Joint von KADOGUCHI, Takuya

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SurfaceTreatment and Solder Jointing Technology of Power Module for xEV von KADOGUCHI, Takuya

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Highly thermostable joint of a Cu/Ni–P plating/Sn–0.7Cu solder added with Cu balls von Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

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Highly thermostable joint of Cu/Ni plating/composite Sn–0.7Cu solder with added Cu balls for die attachment in power modules von Kadoguchi, Takuya, Take, Naoya, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

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Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density von Kadoguchi, Takuya, Gotou, Keisuke, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

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Packaging Technology in Power Module for Electric Vehicles von Kadoguchi, Takuya

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Evaluation of the number density of nuclei in Li2O·2SiO2 glass by DTA method von Wakasugi, Takashi, Kadoguchi, Takuya, Ota, Rikuo

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xEV向けパワーモジュールの表面処理とはんだ接合技術 von 門口, 卓矢

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Semiconductor device and manufacturing method thereof with Cu and Sn intermetallic compound von Kadoguchi, Takuya

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF von KADOGUCHI, Takuya

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Verfahren zur Herstellung einer Halbleitervorrichtung von Kadoguchi, Takuya

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE von TAKUYA KADOGUCHI

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はんだ接合部のエレクトロマイグレーション現象 von 門口, 卓矢

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE von KADOGUCHI, Takuya

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Evaluation of Crystal Growth Rate by Isothermal DTA von WAKASUGI, Takashi, KADOGUCHI, Takuya, TANAKA, Katsuhisa, OTA, Rikuo

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Semiconductor device and manufacturing method for the semiconductor device von KADOGUCHI, Takuya

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Semiconductor device von Takahagi, Satoshi, Kadoguchi, Takuya

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Semiconductor device and manufacturing method for the semiconductor device von Kadoguchi Takuya

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Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device von Kadoguchi Takuya

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