High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes von Ho, C.E., Hsieh, W.Z., Lee, P.T., Huang, Y.H., Kuo, T.T.

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Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification von Huang, Y.H., Yang, S.P., Lee, P.T., Kuo, T.T., Ho, C.E.

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IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique von Ho, C.E., Yang, S.P., Lee, P.T., Lee, C.Y., Chen, C.C., Kuo, T.T.

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Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications von Ho, C.E., Kuo, T.T., Gierlotka, W., Ma, F.M.

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Interfacial Reaction and Mechanical Characterization of Sn–Ag–Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition von Ho, C.E., Hsieh, W.Z., Yang, C.H., Yeh, T.C., Kuo, T.T.

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Influence of Pd(P) thickness on the Pd-free solder reaction between eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu multilayer von Lee, C.Y., Yang, S.P., Yang, C.H., Lu, M.K., Kuo, T.T., Ho, C.E.

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Interfacial microstructures and mechanical properties of molten Sn reacting with Ni– x P films von Hsieh, W.Z., Rahman, M.A., Yang, T.H., Kuo, T.T., Ho, C.E.

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Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad von Wu, Y.S., Lee, P.T., Hsieh, W.Z., Kuo, T.T., Ho, C.E.

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Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy von Huang, Y.H., Hsieh, W.Z., Lee, P.T., Wu, Y.S., Kuo, T.T., Ho, C.E.

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Interfacial microstructures and mechanical properties of molten Sn reacting with Ni–xP films von Hsieh, W.Z., Rahman, M.A., Yang, T.H., Kuo, T.T., Ho, C.E.

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Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering von Ho, C.E., Fan, C.W., Wu, W.H., Kuo, T.T.

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XPC-PARP complexes engage the chromatin remodeler ALC1 to catalyze global genome DNA damage repair von Blessing, C., Apelt, K., Heuvel, D. van den, Gonzalez-Leal, C., Rother, M.B., Woude, M. van der, Gonzalez Prieto, R., Yifrach, A., Parnas, A., Shah, R.G., Kuo, T.T., Boer, D.E.C., Cai, J., Kragten, A., Kim, H.S., Scharer, O.D., Vertegaal, A.C.O., Shah, G.M., Adar, S., Lans, H., Attikum, H. van, Ladurner, A.G., Luijsterburg, M.S.

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Simultaneous occurrence of papulonecrotic tuberculide and erythema induratum and the identification of Mycobacterium tuberculosis DNA by polymerase chain reaction von CHUANG, Y.H., KUO, T.T., WANG, C.M., WANG, C.N., WONG, W.R., CHAN, H.L.

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Shell model Monte Carlo method for two-neutrino double beta decay von Radha, PB, Dean, DJ, Koonin, SE, Kuo, TT, Langanke, K, Poves, A, Retamosa, J, Vogel, P

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Rejuvenation of Sequoia sempervirens in vitro: Changes in isoesterases and isoperoxidases von Huang, H.J. (Academia Sinica, Taipei (Taiwan)), Chen, Y, Kuo, J.L, Kuo, T.T, Tzeng, C.C, Huang, B.L, Chen, C.M, Huang, L.C

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FACTORS INFLUENCING THE PRODUCTION AND FURTHER METABOLISM OF INDOLE-3-ACETIC ACID BY PSEUDOMONAS SAVASTANOI von KUO, T.T., KOSUGE, TSUNE

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variant of Saccharomyces cerevisiae pep4 strain with improved oligotrophic proliferation, cell survival and heterologous secretion of alpha-amylase von Chen, D.C, Chen, S.Y, Gee, M.F, Pan, J.T, Kuo, T.T

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Nuclear symmetry energy von Lee, C.-H., Kuo, T., Li, G., Brown, G.

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Disassociation of σ subunit from RNA polymerase of Xanthomonas oryzae pv. oryzae by phage Xp10 infection von Lin, Shan-Hua, Liu, Jun-Sheng, Yang, Bei-Chang, Kuo, Tsong-Teh

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Characterization of an open reading frame involved in site-specific integration of filamentous phage Cf1t from Xanthomonas campestris pv. citri von Shieh, G.J, Lin, C.H, Kuo, J.L, Kuo, T.T

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