Highly Conductive and Thermally Stable Self-doping Propylthiosulfonated Polyanilines von Han, Chien-Chung, Lu, Chia-Hui, Hong, Shih-Ping, Yang, Ku-Feng

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Highly Conductive New Aniline Copolymers Containing Butylthio Substituent von Han, Chien-Chung, Hong, Shih-Ping, Yang, Ku-Feng, Bai, Meng-Yi, Lu, Chia-Hui, Huang, Chao-Sheng

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A novel method for making highly dispersible conducting polymer and concentric graphitic carbon nano-spheres based on an undoped and functionalized polyaniline von HAN, Chien-Chung, BAI, Meng-Yi, YANG, Ku-Feng, LEE, Yi-Shuan, LIN, Chia-Wei

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Syntheses and characterizations of aniline/butylthioaniline copolymers: Comparisons of copolymers prepared by the new concurrent reduction and substitution route and the convention... von Han, Chien-Chung, Yang, Ku-Feng, Hong, Shih-Ping, Balasubramanian, Arumugam, Lee, Yi-Te

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BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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Bonding structures of integrated circuit devices and method forming the same von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE von CHENG, Kuang-Wei, CHANG, Chih-Hang, YANG, Ku-Feng

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GATE PATTERNING FOR STACKED DEVICE STRUCTURE USING SELF-ASSEMBLED MONOLAYER von Yang, Ku-Feng, Liao, Szuya, Chiu, TsungKai, Shih, Che Chi

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Bonding structures of integrated circuit devices and method forming the same von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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Through-substrate vias with improved connections von Yang, Ku-Feng, Lin, Jing-Cheng

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BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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Selective epitaxy process for the formation of CFET local interconnection von Woon, Wei-Yen, Yang, Ku-Feng, Liao, Szuya, Hung, Hsin Yang, Shih, Che Chi

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APPARATUS AND METHOD FOR WAFER PRE-WETTING von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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HEAT SINK FOR STACKED MULTI-GATE DEVICE von Woon, Wei-Yen, Yang, Ku-Feng, Liao, Szuya, Shih, Che Chi

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HETEROGENEOUS DIELECTRIC BONDING SCHEME von Yu, Chen-Hua, Chung, Ming-Tsu, Yang, Ku-Feng, Chiou, Wen-Chih

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Plating apparatus for plating semiconductor wafer and plating method von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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Apparatus and method for wafer pre-wetting von Yang, Ku-Feng, Chiou, Wen-Chih, Tsai, Chen-Yu

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TSV STRUCTURE AND METHOD FORMING SAME von Wu, Tsang-Jiuh, Yu, Chen-Hua, Chung, Ming-Tsu, Yang, Ku-Feng, Chiou, Wen-Chih

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SEMICONDUCTOR DEVICE MANUFACTURING ON ASSEMBLED WAFER von Tsai, Chen-Fong, Yang, Ku-Feng, Hu, Kuan-Kan, Chen, Han-De, Chui, Chi On

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