Stretching versus transitory icing: which is the more effective treatment for attenuating muscle fatigue after repeated manual labor? von Eguchi, Yasumasa, Jinde, Manabu, Murooka, Kazuki, Konno, Yoshimasa, Ohta, Masanori, Yamato, Hiroshi

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The relationship between work ability and oxidative stress in Japanese workers von Ohta, Masanori, Kumashiro, Masaharu, Eguchi, Yasumasa, Morita, Yusaku, Konno, Yoshimasa, Yamato, Hiroshi

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Sense of coherence is significantly associated with both metabolic syndrome and lifestyle in Japanese computer software office workers von Morita, Yusaku, Ohta, Masanori, Inoue, Tomohiro, Honda, Toru, Konno, Yoshimasa, Eguchi, Yasumasa, Yamato, Hiroshi

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Effects of bench step exercise intervention on work ability in terms of cardiovascular risk factors and oxidative stress: a randomized controlled study von Ohta, Masanori, Eguchi, Yasumasa, Inoue, Tomohiro, Honda, Toru, Morita, Yusaku, Konno, Yoshimasa, Yamato, Hiroshi, Kumashiro, Masaharu

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Effects of Transitory Stimulation Interval Exercise on Physical Function: A Randomized Controlled Pilot Study among Japanese Subjects von EGUCHI, Yasumasa, OHTA, Masanori, INOUE, Tomohiro, HONDA, Toru, MORITA, Yusaku, KONNO, Yoshimasa, YAMATO, Hiroshi

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Reconstruction Method of Trimmed Surfaces Maintaining G 1 -Continuity with Adjacent Surfaces von Muraki, Yuta, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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High-quality Approximation Technique for Two G 1 -continuous Offset Surfaces von Satoh, Naoyuki, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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TWI743632B von KONNO, YOSHIMASA, MAEDA, TAKESHI

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반도체 밀봉용 성형 재료, 반도체 밀봉용 성형 재료의 제조 방법 및 그것을 사용한 반도체 장치 von KONNO YOSHIMASA, MAEDA TAKESHI

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Molding material for semiconductor encapsulation, production method of molding material for semiconductor encapsulation, and semiconductor device using this von KONNO, YOSHIMASA, MAEDA, TAKESHI

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Reconstruction Method of Trimmed Surfaces Maintaining G1-Continuity with Adjacent Surfaces von Muraki, Yuta, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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High-quality Approximation Technique for Two G1-continuous Offset Surfaces von Satoh, Naoyuki, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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MOLDING MATERIAL FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD OF MOLDING MATERIAL FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THIS von KONNO, Yoshimasa, MAEDA, Takeshi

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Data Compression Method for Trimmed Surfaces Based on Surface Fitting with Maintaining G 1 Continuity with Adjacent Surfaces von Muraki, Yuta, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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MOLDING MATERIAL FOR SEMICONDUCTOR ENCAPSULATION, PRODUCTION METHOD OF MOLDING MATERIAL FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE MOLDING MATERIAL von KONNO YOSHIMASA, MAEDA GO

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Data Compression Method for Trimmed Surfaces Based on Surface Fitting with Maintaining G1 Continuity with Adjacent Surfaces von Muraki, Yuta, Matsuyama, Katsutsugu, Konno, Kouichi, Tokuyama, Yoshimasa

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短時間刺激型インターバル運動が身体諸機能に及ぼす効果－日本人における無作為化比較介入試験によるパイロット研究 von 江口, 泰正, 太田, 雅規, 井上, 智博, 本多, 融, 守田, 祐作, 今野, 由将, 大和, 浩

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Reparameterization of piecewise rational Bezier curves and its applications von Tokuyama, Yoshimasa, Konno, Kouichi

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Approximate conversion of a rational boundary Gregory patch to a nonuniform B-spline surface von TOKUYAMA, Y, KONNO, K

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A Study on Generating Section Lines to Make Measured Drawings of Earthenware Artifacts von Konno, Kouichi, Abe, Naoki, Chiba, Fumito, Tokuyama, Yoshimasa

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