An overview of through-silicon-via technology and manufacturing challenges von Gambino, Jeffrey P., Adderly, Shawn A., Knickerbocker, John U.

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Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers von Doany, F. E., Schow, C. L., Lee, B. G., Budd, R. A., Baks, C. W., Tsang, C. K., Knickerbocker, J. U., Dangel, R., Chan, B., How Lin, Carver, C., Jianzhuang Huang, Berry, J., Bajkowski, D., Libsch, F., Kash, J. A.

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3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias von Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Buchwalter, L.P., Sprogis, E.J., Hua Gan, Horton, R.R., Polastre, R.J., Wright, S.L., Cotte, J.M.

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CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling von Sakuma, Katsuyuki, Hu, Huan, Liu, Xiao Hu, Ni, Jiamin, Bedell, Stephen W., Webb, Bucknell, Wright, Steven L., Lauro, Paul, Latzko, Ken, Agno, Marlon, Tornello, James, Knickerbocker, John U.

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An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects von Dickson, T. O., Yong Liu, Rylov, S. V., Bing Dang, Tsang, C. K., Andry, P. S., Bulzacchelli, J. F., Ainspan, H. A., Xiaoxiong Gu, Turlapati, L., Beakes, M. P., Parker, B. D., Knickerbocker, J. U., Friedman, D. J.

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Development of vacuum underfill technology for a 3D chip stack von Sakuma, Katsuyuki, Kohara, Sayuri, Sueoka, Kuniaki, Orii, Yasumitsu, Kawakami, Mikio, Asai, Kazuo, Hirayama, Yoshikazu, Knickerbocker, John U

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Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects von Doany, Fuad E, Lee, Benjamin G, Schow, Clint L, Tsang, Cornelia K, Baks, Christian, Kwark, Young, John, Richard, Knickerbocker, John U, Kash, Jeffrey A

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Miniaturized electronics package with patterned thin film solid state battery von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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Miniaturized electronics package with patterned thin film solid state battery von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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Strain gauge structure for a sensor von Knickerbocker, John U, Sakuma, Katsuyuki, Lu, Minhua

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Molten solder injection head with vacuum filter and differential gauge system von Nah, Jae-Woong, Knickerbocker, John U, Lewandowski, Eric P

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Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding von Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D

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Method of forming a field effect based nanopore device von Leobandung, Effendi, Knickerbocker, John U

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Activity and Reactivity of Carbon Formed by the Thermal Degradation of Poly(vinyl butyral) in Alumina Pellets von Boddu, Mallu V., Viswanath, Dabir S., Natarajan, Govindarajan, Knickerbocker, John U.

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IR assisted fan-out wafer level packaging using silicon handler von Dang, Bing, Knickerbocker, John U, Gelorme, Jeffrey D

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MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STATE BATTERY von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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MINIATURIZED ELECTRONICS PACKAGE WITH PATTERNED THIN FILM SOLID STATE BATTERY von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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24-channel optical transceiver module for waveguide-on-card interconnects von Kash, Jeffrey A, Schow, Clint L, Doany, Fuad E, Lee, Benjamin G, Tsang, Cornelia K, Baks, Christian, Young Kwark, Knickerbocker, John U

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Miniaturized electronics package with patterned thin film solid state battery von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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Miniaturized electronics package with patterned thin film solid state battery von Dang, Bing, Knickerbocker, John U, Chen, Qianwen

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