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  1. 1
    SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

    SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE von PARK YOUNG-SOO, LIM YOUNG-SAM, KANG PIL KYU, KIN EINAN, KIN KOSHO

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  2. 2
    METHOD OF FORMING POROUS MATERIAL FILM OF SEMICONDUCTOR DEVICE

    METHOD OF FORMING POROUS MATERIAL FILM OF SEMICONDUCTOR DEVICE von JEONG HYUN DAM, LEE SENREI, KIN EINAN, KIM JIN-SUNG

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  3. 3
    WAFER CARRIER FOR MINIMIZING CONTACT AREA WITH WAFER AND WAFER WASHING METHOD USING IT

    WAFER CARRIER FOR MINIMIZING CONTACT AREA WITH WAFER AND WAFER WASHING METHOD USING IT von LIM YOUNG-SAM, KIN EINAN, KANG DAE-WON, KIN KOSHO, CHON SANG-MOON

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  4. 4
    COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE

    COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE von KIN EINAN, KIM HYUN-JOON, KYO TOBIN, TAKASHIMA MASAYUKI, SON HEIU, RI SHUNTOKU, MEI JUZAI, PARK BENKEI

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  5. 5
    METHOD FOR DETERMINING THICKNESS OF MASKING PHOTORESIST IN SEMICONDUCTOR-ION-IMPLANTATION PROCESS

    METHOD FOR DETERMINING THICKNESS OF MASKING PHOTORESIST IN SEMICONDUCTOR-ION-IMPLANTATION PROCESS von KIN EINAN, RI MEIRAKU, TEI SEIKAN

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