Influence of SPS Decomposition Product 1,3-Propane Disulfonic Acid on Electrolytic Copper Via Filling Performance von Kimizuka, Ryoichi, Toda, Hisayuki, Eda, Tetsuro, Kishimoto, Kazuki, Oh, Reisei, Honma, Hideo, Takai, Osamu

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Through-Hole Filling by Copper Electroplating von Dow, Wei-Ping, Chen, Hsiang-Hao, Yen, Ming-Yao, Chen, Wei-Hsiang, Hsu, Kao-Hsuang, Chuang, Po-Yao, Ishizuka, Hiroshi, Sakagawa, Nobuo, Kimizuka, Ryoichi

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Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold von Endo, Hitoshi, Tashiro, Katsuhiko, Ma, Hengyi, Mizuhashi, Shoei, Yamamoto, Taibo, Kimizuka, Ryoichi, Takai, Osamu, Honma, Hideo, Cordonier, Christopher E. J.

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Let's learn what is needed in the world, and let's create “Something New” von KIMIZUKA, Ryoichi

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Erratum: Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold [J. Electrochem. Soc., 162, D193 (2015)] von Endo, Hitoshi, Tashiro, Katsuhiko, Ma, Hengyi, Mizuhashi, Shoei, Yamamoto, Taibo, Kimizuka, Ryoichi, Takai, Osamu, Honma, Hideo, Cordonier, Christopher E. J.

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A Study on the Decomposition of SPS and Its Effects on Via Filling Performance von Kimizuka, Ryoichi, Toda, Hisayuki, Eda, Tetsuro, Kishimoto, Kazuki, Takaya, Yasuko, Oh, Reisei, Takai, Osamu

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世の中に必要なものは何か，そしてSomething Newを創り出そう von 君塚, 亮一

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Technology of Copper Via Filling von EDA, Tetsuro, HAGIWARA, Hideki, KIMIZUKA, Ryoichi

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Technology of Copper Via Filling von EDA, Tetsuro, HAGIWARA, Hideki, KIMIZUKA, Ryoichi

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ビアフィリング銅めっき技術 von 君塚, 亮一, 萩原, 秀樹

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METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION von TODA, Hisayuki, KIMIZUKA, Ryoichi, TAKAYA, Yasuko, EDA, Tetsuro, KISHIMOTO, Kazuki

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Anodic Oxidation of SPS Resulting in PDS Formation and the Influence of PDS on Electrolytic Copper Via Filling Performance von Kimizuka, Ryoichi, Toda, Hisayuki, Eda, Tetsuro, Takai, Osamu

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Blackening Zinc-Nickel Alloy Plating and Corrosion/Heat Resist Effects von KIMIZUKA, Ryoichi

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ビアフィリング銅めっき技術 von 江田, 哲朗, 萩原, 秀樹, 君塚, 亮一

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METAL BLACKENING LIQUID, TREATMENT METHOD FOR BLACKENING METAL WITH THE USE OF THE METAL BLACKENING LIQUID, AND PRODUCT BLACKENED WITH THE TREATMENT METHOD FOR BLACKENING METAL von SATO TAKURO, KIMIZUKA RYOICHI

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TWI693308B von KISHIMOTO, KAZUKI, KIMIZUKA, RYOICHI, TODA, HISAYUKI, EDA, TETSURO, TAKAYA, YASUKO

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Acid Copper Plating Technology for Electronics (Electro Device) Field von HAGIWARA, Hideki, KOBAYASHI, Takeshi, KIMIZUKA, Ryoichi

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METHOD OF PRODUCING FINE WIRING von HAGIWARA HIDEKI, KIMIZUKA RYOICHI

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ACID COPPER ELECTROPLATING SOLUTION von SAKAKAWA NOBUO, TAKATANI YASUKO, HAGIWARA HIDEKI, KIMIZUKA RYOICHI

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Polishing liquid, polishing method and polishing apparatus von Hongo, Akihisa, Kimizuka, Ryoichi

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