BUILDING EXTERIOR PANEL HAVING SUPERIOR SEISMIC CAPABILITY von KIM JONGHEUM

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Apparatus for inserting watermark and method therefor von Kim, Jongheum, Kim, Jongan

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Apparatus for inserting watermark and method therefor von KIM JONGAN, KIM JONGHEUM

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APPARATUS FOR INSERTING WATERMARK AND METHOD THEREFOR von KIM JONGAN, KIM JONGHEUM

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APPARATUS AND METHOD FOR INSERTING A WATERMARK von KIM, JONGAN, KIM, JONGHEUM

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APPARATUS AND METHOD FOR INSERTING A WATERMARK von KIM, JONGAN, KIM, JONGHEUM

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Chaos-assisted turbulence in spinor Bose-Einstein condensates von Kim, Jongmin, Jung, Jongheum, Lee, Junghoon, Hong, Deokhwa, Shin, Y.

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Chaos-assisted Turbulence in Spinor Bose-Einstein Condensates von Kim, Jongmin, Jung, Jongheum, Lee, Junghoon, Hong, Deokhwa, Shin, Yong-il

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Chaos-assisted Turbulence in Spinor Bose-Einstein Condensates von Kim, Jongmin, Jung, Jongheum, Lee, Junghoon, Hong, Deokhwa, Yong-il Shin

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Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound von Yoon, JongHeum, Lee, Hyuk Soo, Yun, SungJin, Moon, SungBae, Kim, Hae Yeon, Jeong, Jaehun, Park, Jeungook, Park, Jae Man, Cho, In Hee

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Image encoding apparatus and method of camera device von LEE KANGMIN, KIM MYOUNGWON, YIM SUNGJUN, KIM JAEDONG, HAN JONGHEUM, KIM MOONSOO

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Method and apparatus for image data processing, and electronic device including the apparatus von KIM, MOONSOO, JANG, HYOSIK, HAN, JONGHEUM, CHAE, YONGSU, KIM, JAEDONG, KIM, MYOUNGWON

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METHOD AND APPARATUS FOR IMAGE DATA PROCESSING, AND ELECTRONIC DEVICE INCLUDING THE APPARATUS von KIM MYOUNGWON, CHAE YONGSU, KIM JAEDONG, HAN JONGHEUM, KIM MOONSOO, JANG HYOSIK

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Method and apparatus for image data processing, and electronic device including the apparatus von KIM, MOONSOO, JANG, HYOSIK, HAN, JONGHEUM, CHAE, YONGSU, KIM, JAEDONG, KIM, MYOUNGWON

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IMAGE ENCODING APPARATUS AND METHOD OF CAMERA DEVICE von LEE KANGMIN, KIM MYOUNGWON, YIM SUNGJUN, KIM JAEDONG, HAN JONGHEUM, KIM MOONSOO

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Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound von YUN SUNGJIN, MOON SUNGBAE, YOON JONGHEUM, CHO IN HEE, KIM HAE YEON, PARK JEUNGOOK, JEONG JAEHUN, PARK JAE MAN, LEE HYUK SOO

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Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound von YOON, JONGHEUM, MOON, SUNGBAE, PARK, JEUNGOOK, YUN, SUNGJIN, KIM, HAE YEON, CHO, IN HEE, PARK, JAE MAN, JEONG, JAEHUN, LEE, HYUK SOO

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EPOXY RESIN, EPOXY RESIN COMPOSITION CONTAINING THE SAME, AND HEAT DISSIPATION CIRCUIT BOARD USING THE SAME von YUN SUNGJIN, MOON SUNGBAE, YOON JONGHEUM, CHO IN HEE, KIM HAE YEON, PARK JEUNGOOK, JEONG JAEHUN, PARK JAE MAN, LEE HYUK SOO

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Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound von YOON, JONGHEUM, MOON, SUNGBAE, PARK, JEUNGOOK, YUN, SUNGJIN, KIM, HAE YEON, CHO, IN HEE, PARK, JAE MAN, JEONG, JAEHUN, LEE, HYUK SOO

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EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND von YUN SUNGJIN, MOON SUNGBAE, YOON JONGHEUM, CHO IN HEE, KIM HAE YEON, PARK JEUNGOOK, JEONG JAEHUN, PARK JAE MAN, LEE HYUK SOO

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