Electromigration in Thin Films and Electronic Devices - Materials and Reliability von Kim, Choong-Un

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Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit von Duryat, Rahmat Saptono, Kim, Choong-Un

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Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer von Madanipour, Hossein, Kim, Yi-Ram, Kim, Choong-Un, Mishra, Dibyajat, Thompson, Patrick

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A Model-Inspired Phenomenology Constitutive Equation for the Temperature-Dependence of Flow Stress at Confined Dimension I von Kim, Choong Un, Saptono, Rahmat

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CMOS-compatible fabrication of room-temperature single-electron devices von Ray, Vishva, Subramanian, Ramkumar, Bhadrachalam, Pradeep, Ma, Liang-Chieh, Kim, Choong-Un, Koh, Seong Jin

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A Model-inspired Phenomenology Constitutive Equation for the Temperature-dependence of Flow Stress at Confined Dimension II von Duryat, Rahmat Saptono, Kim, Choong-Un

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Thin Film materials for solar cell and biosensor applications von Kim, Choong-Un

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Electromigration in Cu thin films with Sn and Al cross strips von Michael, Nancy L., Kim, Choong-Un

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Photocatalytic and photoluminescence properties of ZnO/graphene quasi core-shell nanoparticles von Haghshenas, S. Siamak P., Nemati, Ali, Simchi, Reza, Kim, Choong-Un

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Dispute in photocatalytic and photoluminescence behavior in ZnO/graphene oxide core-shell nanoparticles von Haghshenas, S. Siamak P., Nemati, Ali, Simchi, A., Kim, Choong-Un

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Influence of defects and nanoscale strain on the photovoltaic properties of CdS/CdSe nanocomposite co-sensitized ZnO nanowire solar cells von Jung, Kyungeun, Lee, Jeongwon, Kim, Young-Min, Kim, Joosun, Kim, Choong-Un, Lee, Man-Jong

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Impact of in situ current stressing on Sn-based solder joint shear stability von Fuller, Scott, Sheikh, Mohamed, Baty, Greg, Kim, Choong-Un, Lee, Tae-Kyu

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Intermetallic Compound Growth and Stress Development in Al-Cu Diffusion Couple von Mishler, M., Ouvarov-Bancalero, V., Chae, Seung H., Nguyen, Luu, Kim, Choong-Un

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Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects von Lee, Tae-Kyu, Kim, Choong-Un, Bieler, Thomas R.

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Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing von Kim, Choong-Un, Bang, Woong-Ho, Xu, Huili, Lee, Tae-Kyu

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High-Temperature Magnetic Properties of Exchange-Coupled Sm-Co/Nd-Fe-B Hybrid Nanocomposite Magnets von Poudyal, Narayan, Mohapatra, Jeotikanta, Xing, Meiying, Kim, Choong-Un, Liu, J. Ping

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Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects von Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un

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Electrostatic Funneling for Precise Nanoparticle Placement:  A Route to Wafer-Scale Integration von Ma, Liang-Chieh, Subramanian, Ramkumar, Huang, Hong-Wen, Ray, Vishva, Kim, Choong-Un, Koh, Seong Jin

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Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance von Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un

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Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications von Zin, Emil H., Bang, W. H., Todd Ryan, E., King, Sean W., Kim, Choong-Un

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