A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding von Kim, B.-H., Kim, J.-B., Kim, J.-H.

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Characterization of Ca Precipitation in Al-Mg Alloys Containing a Trace of Ca During Homogenization von Ha, Seong-Ho, Shin, Young-Chul, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Lim, Sung-Hwan, Kim, Shae K

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Effect of Cu Addition on Oxide Growth of Al-7 mass%Mg Alloy at High Temperature von Ha, Seong-Ho, Shah, Abdul Wahid, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K

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Microstructure Formation of Al-5 mass%Mg Alloy Melts by Interaction with Silica von Kim, Sun-Ki, Ha, Seong-Ho, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K, Kim, Young-Jig

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Influence of Si Addition on Oxide Growth of Al-6 mass%Mg Alloy Melts von Yoon, Young-Ok, Ha, Seong-Ho, Shah, Abdul Wahid, Kim, Bong-Hwan, Lim, Hyun-Kyu, Kim, Shae K

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Stretch Forming Behavior and Constitutive Equation of a Modified 5083 Alloy with High Mg Content at Elevated Temperatures von Yang, Seung-Yoon, Lee, Da-Bin, Choi, Kweon-Hoon, Kim, Nam-Seok, Ha, Seong-Ho, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K., Kim, Young-Jig

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Hot Compression Behavior of New Al-6Mg and Al-8Mg Alloy with Improved Hot Workability Fabricated by Direct Chill Casting Method von Kim, Nam-Seok, Choi, Kweon-Hoon, Yang, Seung-Yoon, Ha, Seong-Ho, Yoon, Young-Ok, Kim, Bong-Hwan, Lim, Hyun-Kyu, Kim, Shae K., Hyun, Soong-Keun

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Effect of Combined Extrusion and Rolling Parameters on Mechanical and Corrosion Properties of New High Strength Al-Mg Alloy von Choi, Kweon-Hoon, Kim, Bong-Hwan, Lee, Da-Bin, Yang, Seung-Yoon, Kim, Nam-Seok, Ha, Seong-Ho, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae-Kwang

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Microstructures, tensile properties, and strengthening mechanisms of novel Al-Mg alloys with high Mg content von Baek, Min-Seok, Shah, Abdul Wahid, Kim, Young-Kyun, Kim, Shae-K., Kim, Bong-Hwan, Lee, Kee-Ahn

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Design and fabrication of a highly manufacturable MEMS probe card for high speed testing von Kim, Bong-Hwan, Kim, Jong-Bok

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Image quality enhancement in variable-refresh-rate AMOLED displays using a variable initial voltage compensation scheme von Kim, Li Jin, Jung, Sujin, Kim, Hee Jun, Kim, Bong Hwan, Kwon, Kyung Joon, Ha, Yong Min, Kim, Hyun Jae

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Effect of Ca addition on selective oxidation of Al3Mg2 phase in Al-5 mass% Mg alloy von Kim, Bong-Hwan, Ha, Seong-Ho, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K., Kim, Do-Hyang

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Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications von Kim, Bong-Hwan, Kim, Jong-Bok

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Forgeability assessment of Al-6 wt%Mg alloy using biaxial alternate forging von Shin, Young-Chul, Ha, Seong-Ho, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Sung-Hwan, Choi, Ho-Joon, Kim, Shae K., Hyun, Soong-Keun

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Process effects of double step DRIE and Ni–Co electroplating for a trench-type cantilever probe for a fine-pitched MEMS probe card von Kim, Bong-Hwan, Park, Bum-Jin, Kim, Jong Bok

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Reaction pathway of NiAl/WC nanocomposite synthesized from mechanical activated Ni Al W C powder system von Zarezadeh Mehrizi, M., Momeni, M.R., Beygi, R., Eisaabadi B., G., Kim, Bong-Hwan, Kim, Shae-Kwan

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Investigating the Influence of Mg Content Variations on Microstructures, Heat-Treatment, and Mechanical Properties of Al-Cu-Mg Alloys von Shah, Abdul Wahid, Ha, Seong-Ho, Siddique, Jabir Ali, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K

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Aluminum-doped zinc oxide thin films grown on various substrates using facing target sputtering system von Kim, Hwa-Min, Lee, Chang Hyun, Shon, Sun Young, Kim, Bong Hwan

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Microstructure Evolution and Mechanical Properties of Al-Cu-Mg Alloys with Si Addition von Shah, Abdul Wahid, Ha, Seong-Ho, Siddique, Jabir Ali, Kim, Bong-Hwan, Yoon, Young-Ok, Lim, Hyun-Kyu, Kim, Shae K

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Effects of Main Alloying Elements on Interface Reaction between Tool Steel and Molten Aluminum von Yoon, Young-Ok, Kim, Nam-Seok, Ha, Seong-Ho, Kim, Bong-Hwan, Lim, Hyun-Kyu, Kim, Shae K.

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