High-Performance, Transparent, and Stretchable Electrodes Using Graphene–Metal Nanowire Hybrid Structures von Lee, Mi-Sun, Lee, Kyongsoo, Kim, So-Yun, Lee, Heejoo, Park, Jihun, Choi, Kwang-Hyuk, Kim, Han-Ki, Kim, Dae-Gon, Lee, Dae-Young, Nam, SungWoo, Park, Jang-Ung

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A thin all-elastomeric capacitive pressure sensor array based on micro-contact printed elastic conductors von Woo, Su-Jeong, Kong, Jeong-Ho, Kim, Dae-Gon, Kim, Jong-Man

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Stretchable, Transparent Graphene Interconnects for Arrays of Microscale Inorganic Light Emitting Diodes on Rubber Substrates von Kim, Rak-Hwan, Bae, Myung-Ho, Kim, Dae Gon, Cheng, Huanyu, Kim, Bong Hoon, Kim, Dae-Hyeong, Li, Ming, Wu, Jian, Du, Frank, Kim, Hoon-Sik, Kim, Stanley, Estrada, David, Hong, Suck Won, Huang, Yonggang, Pop, Eric, Rogers, John A

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Two-point coupling method to independently control coupling efficiency at different wavelengths von Kim, Dohyeong, Han, Sangyoon, Kim, Dae-Gon, Ko, Kiyoung, Choi, Duk-Yong, Lee, Hansuek

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Supercontinuum generation in As2S3 waveguides fabricated without direct etching von Hwang, Joonhyuk, Kim, Dae-Gon, Han, Sangyoon, Jeong, Dongin, Lee, Yong-Hee, Choi, Duk-Yong, Lee, Hansuek

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Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor von Kim, Dae-Gon, Kim, Jiwan, Jung, Seung-Boo, Kim, Young-Sung, Kim, Jong-Woong

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Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM von Kim, Dae-Gon, Kim, Jong-Woong, Jung, Seung-Boo

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Seasonal Characteristics of Volatile Organic Compounds in Seoul, Korea: Major Sources and Contribution to Secondary Organic Aerosol Formation von Lee, Yeonjung, Won, Soo Ran, Shin, Hye Jung, Kim, Dae Gon, Lee, Ji Yi

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Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate von Yoon, Jeong-Won, Lee, Young-Ho, Kim, Dae-Gon, Kang, Han-Byul, Suh, Su-Jeong, Yang, Cheol-Woong, Lee, Chang-Bae, Jung, Jong-Man, Yoo, Choong-Sik, Jung, Seung-Boo

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Minimally invasive treatment for esthetic enhancement of white spot lesion in adjacent tooth von Lee, Ji-Hye, Kim, Dae-Gon, Park, Chan-Jin, Cho, Lee-Ra

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MEMS-based in-situ tensile experiments designed to arrest catastrophic failure in brittle nanomaterials von Ahn, Daehyeok, Kim, Dae-Gon, Lee, Hansuek, Jang, Dongchan

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Three-dimensional morphometric study on the retromolar pad von Cha, Min-Sang, Kim, Dae-Gon, Huh, Yoon-Hyuk, Cho, Lee-Ra, Park, Chan-Jin

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Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections von Kim, Jong-Woong, Kim, Dae-Gon, Lee, Young-Chul, Jung, Seung-Boo

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Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps von Kim, Dae-Gon, Moon, Won-Chul, Jung, Seung-Boo

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Simple method for high-performance stretchable composite conductors with entrapped air bubbles von Hwang, Hyejin, Kim, Dae-Gon, Jang, Nam-Su, Kong, Jeong-Ho, Kim, Jong-Man

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Force and torque characteristics for a slotless Lorentz self-bearing servomotor von Stephens, L.S., Dae-Gon Kim

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Investigations of the test parameters and bump structures in the shear test of flip chip solder bump von Kim, Jong-Woong, Kim, Dae-Gon, Jung, Seung-Boo

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Comparison of numerical phase-change models through Stefan vaporizing problem von Kim, Dae Gon, Jeon, Chul Hong, Park, Il Seouk

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Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application von Kim, Dae-Gon, Kim, Jong-Woong, Lee, Jung-Goo, Mori, Hirotaro, Quesnel, David J., Jung, Seung-Boo

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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages von Koo, Ja-Myeong, Kim, Yu-Na, Yoon, Jeong-Won, Kim, Dae-Gon, Noh, Bo-In, Kim, Jong-Woong, Moon, Jung-Hoon, Jung, Seung-Boo

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