Probing toughness of polycarbonate (PC: ductile and brittle)/polypropylene (PP) blends and talc‐triggered PC/PP brittle composites with diverse impact fracture parameters von Jang, Keon‐Soo

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Poly(butylene terephthalate)/poly(ethylene glycol) blends with compatibilizers von Lee, Hayeong, Lee, Tae‐Hee, Kim, Hyungsu, Jang, Keon‐Soo

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Poly(lactic acid)/poly(vinyl butyral) composites containing kaolin modified by acids and calcination von Lee, Hayeong, Park, Jeong‐Ho, Jang, Keon‐Soo

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Compatibilizing effects for semicrystalline polymer‐infiltrated amorphous polymer matrix: Mechanical (toughness), thermal, and morphological behavior of compatibilized polypropylen... von Jang, Keon‐Soo

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Vertically aligned nanostructured gold microtube assisted by polymer template with combination of wet phase inversion and Cu grid mask von Kim, Soohyun, Jang, Keon-Soo

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Incorporation of alkyl‐functionalized silica nanoparticles into hydrophilic epoxy and hydrophobic polystyrene matrices von Lee, Bo‐Young, Park, Seoungju, Chung, Dae‐Won, Jang, Keon‐Soo

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Electrically conductive polystyrene nanocomposites incorporated with aspect ratio‐controlled silver nanowires von Kim, Jung Mock, Jang, Keon‐Soo, Lee, Seong Jae

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Catalysis of Silver and Bismuth in Various Epoxy Resins von Jeong, Hayun, Jang, Keon-Soo

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Circular braided glass fiber/epoxy composites with helical architecture (coil spring) fabricated by plaster‐sacrificial compression molding for structural automotive applications von Kim, Sung Jun, Shin, Jungkyu, Kim, Jae Gwan, Park, Kwang‐Hoon, Jang, Keon‐Soo

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Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering von Han, Seong-Ju, Lee, Seungyeon, Jang, Keon-Soo

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The Role of Surface Treatment and Coupling Agents for Adhesion between Stainless Steel (SUS) and Polyamide (PA) of Heterojunction Bilayer Composites von Lee, Hayeong, Song, Seung-In, Jang, Keon-Soo

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Dispersibility-tailored conductive epoxy nanocomposites with silica nanoparticle-embedded silver nanowires von Kim, Tae Gon, Kim, Jung Mock, Jang, Keon-Soo, Lee, Seong Jae

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Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

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Mechanics and rheology of basalt fiber-reinforced polycarbonate composites von Jang, Keon-Soo

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Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging von Jang, Keon‐Soo, Eom, Yong‐Sung, Choi, Kwang‐Seong, Bae, Hyun‐Cheol

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Copper Sintering Pastes with Various Polar Solvents and Acidic Activators von Lee, Seungyeon, Han, Seong-ju, Kim, Yongjune, Jang, Keon-Soo

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Collective laser‐assisted bonding process for 3D TSV integration with NCP von Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong

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Electrical and Thermal Properties of Surface-Modified Copper Nanowire/Polystyrene Nanocomposites through Latex Blending von Eom, Hyeon Sik, Kim, Dong Won, Jang, Keon-Soo, Lee, Seong Jae

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Low-density polycarbonate composites with robust hollow glass microspheres by tailorable processing variables von Jang, Keon-Soo

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Morphology, electrical conductivity, and rheology of latex-based polymer/nanocarbon nanocomposites von Jang, Keon-Soo, Yeom, Hyo Yeol, Park, Ju Won, Lee, Song Hee, Lee, Seong Jae

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