Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations von Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

Volltext

Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation von Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

Volltext

Facile stoichiometric interfacial surface bonded cerium oxide and graphene oxide heterostructure for efficient electrochemical non-enzymatic detection of dopamine von Annadurai, Hemarani, Vengudusamy, Renganathan, Chen, Shen-Ming, Kao, C. R

Volltext

Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling von Chang, Fu-Ling, Lin, Yu-Hsin, Hung, Han-Tang, Kao, Chen-Wei, Kao, C R

Volltext

Effects of Ti addition to Sn–Ag and Sn–Cu solders von Chen, W.M., Kang, S.K., Kao, C.R.

Volltext

Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone von Maheshwaran, Selvarasu, Balaji, Ramachandran, Chen, Shen-Ming, Biswadeep, Ray, Renganathan, Vengudusamy, Narendhar, Chandrasekar, Kao, C. R

Volltext

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu von Wang, Y.W., Lin, Y.W., Tu, C.T., Kao, C.R.

Volltext

The Demonstration of Carbon Nanotubes (CNTs) as Flip-Chip Connections in 3-D Integrated Circuits With an Ultralow Connection Resistance von Liao, M.-H., Lu, P.-Y., Su, W.-J., Chen, S.-C., Hung, H.-T., Kao, C.-R., Pu, W.-C., Chen, C.-C. A., Lee, M.-H.

Volltext

Interfacial reaction issues for lead-free electronic solders: Lead-free electronic solders von HO, C. E, YANG, S. C, KAO, C. R

Volltext

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration von Kung, Po-Yu, Huang, Wei-Lun, Kao, Chin-Li, Lin, Yung-Sheng, Hung, Yun-Ching, Kao, C. R.

Volltext

Phase field microelasticity model of dislocation climb: Methodology and applications von Ke, J.H., Boyne, A., Wang, Y., Kao, C.R.

Volltext

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering von Chang, C.C., Lin, Y.W., Wang, Y.W., Kao, C.R.

Volltext

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping von Bashir, M. Nasir, Haseeb, A. S. M. A, Rahman, Abu Zayed Mohammad Saliqur, Fazal, M. A, Kao, C. R

Volltext

Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate von Hung, Han-Tang, Chang, Fu-Ling, Tsai, Chin-Hao, Liao, Chia-Yi, Kao, C. R.

Volltext

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications von Yang, T.L., Yu, J.J., Shih, W.L., Hsueh, C.H., Kao, C.R.

Volltext

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni von HO, C. E, TSAI, R. Y, LIN, Y. L, KAO, C. R

Volltext

Effects of bottom topography on dynamics of river discharges in tidal regions: case study of twin plumes in Taiwan Strait von Korotenko, K. A, Osadchiev, A. A, Zavialov, P. O, Kao, R.-C, Ding, C.-F

Volltext

In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing von Lin, Y.H., Hu, Y.C., Tsai, C.M., Kao, C.R., Tu, K.N.

Volltext

Origin and evolution of voids in electroless Ni during soldering reaction von Chung, C. Key, Chen, Y.J., Chen, W.M., Kao, C.R.

Volltext

Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials von Li, C. C, Drymiotis, F, Liao, L. L, Hung, H. T, Ke, J. H, Liu, C. K, Kao, C. R, Snyder, G. J

Volltext