An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate von Seo, Sun-Kyoung, Kang, Sung K., Shih, Da-Yuan, Lee, Hyuck Mo

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Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition von Jung, Myung-Won, Kang, Sung K., Lee, Jae-Ho

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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition von KANG, Sung K, LEONARD, Donovan, SHIH, Da-Yuan, GIGNAC, Lynne, HENDERSON, D. W, CHO, Sungil, JIN YU

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Feasibility and Test-Retest Reliability of an Electroencephalography-Based Brain Mapping System in Children With Cerebral Palsy: A Preliminary Investigation von Lee, Nam G., PT, MS, Kang, Sung K., PT, Lee, Dong R., PT, MS, Hwang, Han J., MS, Jung, Ji H., PT, MS, You, Joshua (Sung) H., PT, PhD, Im, Chang H., PhD, Kim, Dong A., MD, PhD, Lee, Jung A., PT, PhD, Kim, Ki S., MS

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Oxidation study of pure tin and its alloys via electrochemical reduction analysis von CHO, Sungil, JIN YU, KANG, Sung K, SHIH, Da-Yuan

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Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process von Kang, Sung K., Cho, M.G., Lauro, P., Shih, Da-Yuan

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Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging von MOON GI CHO, KANG, Sung K, SHIH, Da-Yuan, HYUCK MO LEE

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Development of conducting adhesive materials for microelectronic applications von Kang, Sung K, Purushothaman, S

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Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films von Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, Lee, Hyuck Mo

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The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy von Seo, Sun-Kyoung, Kang, Sung K., Cho, Moon Gi, Shih, Da-Yuan, Lee, Hyuck Mo

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An optimized protocol of a human-to-cattle interspecies somatic cell nuclear transfer von Chang, Kyung H., Lim, Jeong M., Kang, Sung K., Lee, Byeong C., Moon, Shin Y., Hwang, Woo S.

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Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying von Kang, Sung K., Shih, Da-Yuan, Leonard, Donovan, Henderson, Donald W., Gosselin, Timothy, Cho, Sung-il, Yu, Jin, Choi, Won K.

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Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions von Chang, Jaewon, Kang, Sung K., Lee, Jae-Ho, Kim, Keun-Soo, Lee, Hyuck Mo

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Undercooling and microhardness of Pb-free solders on various under bump metallurgies von Cho, Moon Gi, Kang, Sung K., Lee, Hyuck Mo

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Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys von Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.

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Electromigration performance of Pb-free solder joints in terms of solder composition and joining path von Seo, Sun-Kyoung, Kang, Sung K., Cho, Moon Gi, Lee, Hyuck Mo

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Relationship of plasma Dendroaspis natriuretic peptide-like immunoreactivity and echocardiographic parameters in chronic haemodialysis patients von LEE, SIK, PARK, SUNG K, KANG, KYUNG P, KANG, SUNG K, KIM, SUNG Z, KIM, WON

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Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu von Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung

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An overview of Pb-free, flip-chip wafer-bumping technologies von Kang, Sung K., Gruber, Peter, Shih, Da-Yuan

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Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders von Cho, Moon Gi, Kang, Sung K., Seo, Sun-Kyoung, Shih, Da-Yuan, Lee, Hyuck Mo

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