In Situ Reaction Mechanism Studies on Ozone-Based Atomic Layer Deposition of Al2O3 and HfO2 von Rose, Martin, Niinistö, Jaakko, Endler, Ingolf, Bartha, Johann W, Kücher, Peter, Ritala, Mikko

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Greenwood-Williamson Model Combining Pattern-Density and Pattern-Size Effects in CMP von Vasilev, Boris, Rzehak, Roland, Bott, Sascha, Kücher, Peter, Bartha, Johann W

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Physical and electrical characterization of high-k ZrO2 metal-insulator-metal capacitor von KIM, Joo-Hyung, IGNATOVA, Velislava, KÜCHER, Peter, HEITMANN, Johannes, OBERBECK, Lars, SCHRÖDER, Uwe

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A CMP Model Including Global Distribution of Pressure von Bott, S, Rzehak, R, Vasilev, B, Kücher, Peter, Bartha, J W

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Microstructure in copper interconnects – Influence of plating additive concentration von Neuner, Jürgen, Zienert, Inka, Peeva, Anita, Preuße, Axel, Kücher, Peter, Bartha, Johann W.

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Comparison of MOCVD- and ALD-Deposited HfZrO4 Gate Dielectrics for 32-nm High-Performance Logic SOI CMOS Technologies von KELWING, Torben, NAUMANN, Andreas, HANSCH, Walter, TRENTZSCH, Martin, TRUI, Bernhard, HERRMANN, Lutz, MUTAS, Sergej, GRAETSCH, Falk, CARTER, Rick, STEPHAN, Rolf, KÜCHER, Peter

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Comparison of MOCVD- and ALD-Deposited \hbox Gate Dielectrics for 32-nm High-Performance Logic SOI CMOS Technologies von Kelwing, Torben, Naumann, Andreas, Trentzsch, Martin, Trui, Bernhard, Herrmann, Lutz, Mutas, Sergej, Graetsch, Falk, Carter, Rick, Stephan, Rolf, Kücher, Peter, Hansch, Walter

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Post annealing effect on ultra-thin Hf-based high- k gate oxides on Si von Kim, Joo-Hyung, Ignatova, Velislava A., Kücher, Peter, Weisheit, Martin, Zschech, Ehrenfried

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Novel enhanced stressors with graded encapsulated SiGe embedded in the source and drain areas von Naumann, Andreas, Kronholz, Stephan, Mowry, Anthony, Ostermay, Ina, Bierstedt, Helmut, Trui, Bernhard, Dittmar, Kornelia, Kücher, Peter, Bartha, Johann W., Kammler, Thorsten

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Formation of an interface layer between Al1-xSixOy thin films and the Si substrate during rapid thermal annealing von Michałowski, Paweł Piotr, Beyer, Volkhard, Czernohorsky, Malte, Kücher, Peter, Teichert, Steffen, Jaschke, Gert, Möller, Wolfhard

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AFM tips for 58 nm and smaller node applications von Heidelberg, Andreas, Wu, Xiaoguang, Philipp, Sylke, Weidner, Peter, Kucher, Peter, Bloess, Harald

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A feature scale Greenwood–Williamson model predicting pattern-size effects in CMP von Vasilev, Boris, Bott, Sascha, Rzehak, Roland, Kücher, Peter, Bartha, Johann W.

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Nano-Raman: Monitoring Nanoscale Stress von Uhlig, Benjamin, Zollondz, Jens-Hendrik, Haberjahn, Martin, Bloess, Harald, Kucher, Peter

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Interface engineering for the TaN/Ta barrier film deposition process to control Ta-crystal growth von Gerlich, Lukas, Ohsiek, Susanne, Klein, Christoph, Geiß, Mario, Friedemann, Michael, Kücher, Peter, Schmeißer, Dieter

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In Situ Reaction Mechanism Studies on Ozone-Based Atomic Layer Deposition of Al 2 O 3 and HfO 2 von Rose, Martin, Niinistö, Jaakko, Endler, Ingolf, Bartha, Johann W., Kücher, Peter, Ritala, Mikko

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In situ reaction mechanism studies on ozone-based atomic layer deposition of Al(2)O(3) and HfO(2) von Rose, Martin, Niinistö, Jaakko, Endler, Ingolf, Bartha, Johann W, Kücher, Peter, Ritala, Mikko

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Physical and electrical characterization of high- k ZrO 2 metal–insulator–metal capacitor von Kim, Joo-Hyung, Ignatova, Velislava, Kücher, Peter, Heitmann, Johannes, Oberbeck, Lars, Schröder, Uwe

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Formation of an interface layer between Al 1‐x Si x O y thin films and the Si substrate during rapid thermal annealing von Michałowski, Paweł Piotr, Beyer, Volkhard, Czernohorsky, Malte, Kücher, Peter, Teichert, Steffen, Jaschke, Gert, Möller, Wolfhard

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A roadmap towards cost efficient 300 mm equipment von Pfitzner, Lothar, Kücher, Peter

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Physical and Electrical Properties of MOCVD and ALD Deposited HfZrO 4 Gate Dielectrics for 32nm CMOS High Performance Logic SOI Technologies von Kelwing, Torben, Mutas, Sergej, Trentzsch, Martin, Naumann, Andreas, Trui, Bernhard, Herrmann, Lutz, Graetsch, Falk, Klein, Christoph, Wilde, Lutz, Ohsiek, Susanne, Weisheit, Martin, Peeva, Anita, Richter, Inka, Prinz, Hartmut, Wuerfel, Alexander, Carter, Rick, Stephan, Rolf, Kücher, Peter, Hansch, Walter

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