Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits von Budiman, A.S., Shin, H.-A.-S., Kim, B.-J., Hwang, S.-H., Son, H.-Y., Suh, M.-S., Chung, Q.-H., Byun, K.-Y., Tamura, N., Kunz, M., Joo, Y.-C.

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Effect of saccharin addition on the microstructure of electrodeposited Fe–36 wt.% Ni alloy von Kim, S.-H., Sohn, H.-J., Joo, Y.-C., Kim, Y.-W., Yim, T.-H., Lee, H.-Y., Kang, T.

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Te-centric view of the phase change mechanism in Ge-Sb-Te alloys von Sen, S, Edwards, T G, Cho, J-Y, Joo, Y-C

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On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Techn... von Tian, Tian, Morusupalli, R., Shin, H., Son, H.-Y., Byun, K.-Y., Joo, Y.-C., Caramto, R., Smith, L., Shen, Y-L., Kunz, M., Tamura, N., Budiman, A.S.

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Influence of dopants on atomic migration and void formation in molten Ge2Sb2Te5 under high-amplitude electrical pulse von Yang, T.-Y., Cho, J.-Y., Park, Y.-J., Joo, Y.-C.

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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment von Budiman, A.S., Besser, P.R., Hau-Riege, C.S., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

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Observation of polyamorphism in the phase change alloy Ge1Sb2Te4 von Kalkan, B., Sen, S., Cho, J.-Y., Joo, Y.-C., Clark, S. M.

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Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board von Lee, Shin-Bok, Yoo, Young-Ran, Jung, Ja-Young, Park, Young-Bae, Kim, Young-Sik, Joo, Young-Chang

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Structural Instability in Amorphous In-Ga-Zn-O Films Investigated by Mechanical Stress Analysis von Cho, Ju-Young, Yang, Tae-Youl, Park, Yong-Jin, Lee, Yoo-Yong, Joo, Young-Chang

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Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines von Joo, Y.-C., Thompson, C. V., Baker, S. P., Arzt, E.

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Electromigration in single-crystal aluminum lines with fast diffusion paths made by nanoindentation von Joo, Young-Chang, Baker, S.P., Arzt, E.

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Microstructural Evidence of Abnormal Grain Growth by Solid-State Wetting in Fe-3%Si Steel von Kim, Doh Yeon, Park, Jong Tae, Kim, Jae Kwan, Hwang, Nong Moon, Joo, Young Chang, Park, Hyun

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Impurity redistributions in electroplated Cu films during self-annealing von Yoon, Min-Seung, Park, Young-Joon, Joo, Young-Chang

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Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films von Park, Hyun, Hwang, Soo-Jung, Joo, Young-Chang

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Effect of grain growth stress and stress gradient on stress-induced voiding in damascene Cu/low- k interconnects for ULSI von Paik, Jong-Min, Park, Il-Mok, Joo, Young-Chang

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Anisotropy of grain boundary energies as cause of abnormal grain growth in electroplated copper films von Paik, Jong-Min, Park, Young-Joon, Yoon, Min-Seung, Lee, Je-Hun, Joo, Young-Chang

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Electromigration damage in mechanically deformed Al conductor lines: dislocations as fast diffusion paths von Baker, S.P., Joo, Young-Chang, Knauß, M.P., Arzt, E.

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A new technique to measure through film thickness fracture toughness von Tsui, Ting Y., Joo, Young-Chang

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A model for hillock growth in Al thin films controlled by plastic deformation von Hwang, Soo-Jung, Nix, William D., Joo, Young-Chang

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Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and reliabil... von Budiman, A. S., Shin, H., Kim, B.-J, Hwang, S.-H, Son, H.-Y, Suh, M.-S, Chung, Q.-H, Byun, K.-Y, Joo, Y.-C, Caramto, R., Smith, L., Kunz, M., Tamura, N.

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