Treffer 1 - 3 von 3 für Suche 'Jon-Shiou Peng', Suchdauer: 0,33s Treffer weiter einschränken
  1. 1
    Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film

    Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film von Yu-Wei Huang, Yu-Min Lin, Chau-Jie Zhan, Su-Tsai Lu, Shin-Yi Huang, Jing-Ye Juang, Chia-Wen Fan, Su-Ching Chung, Jon-Shiou Peng, Su-Mei Chen, Yu-Lan Lu, Pai-Cheng Chang, Lau, John H.


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  2. 2
    Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles

    Evaluation of fine-pitch chip-to-chip interconnects using ACF material with arrayed particles von Yu-Wei Huang, Su-Tsai Lu, Jon-Shiou Peng, Chia-Wen Fan, Su-Ching Chung, Su-Mei Chen, Yu-Lan Lu, Pai-Cheng Chang, Chau-Jie Zhan


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  3. 3
    Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

    Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection von Jing-Ye Juang, Shin-Yi Huang, Chau-Jie Zhan, Yu-Min Lin, Yu-Wei Huang, Chia-Wen Fan, Su-Ching Chung, Su-Mei Chen, Jon-Shiou Peng, Yu-Lan Lu, Pai-Cheng Chang, Mei-Lun Wu, Lau, John H.


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