Metallic Nanowires and Their Application von Jinting Jiu, Suganuma, Katsuaki

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Fabrication of Silver Nanowire Transparent Electrodes at Room Temperature von Tokuno, Takehiro, Nogi, Masaya, Karakawa, Makoto, Jiu, Jinting, Nge, Thi Thi, Aso, Yoshio, Suganuma, Katsuaki

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Facile fabrication of stretchable Ag nanowire/polyurethane electrodes using high intensity pulsed light von Yang, Yang, Ding, Su, Araki, Teppei, Jiu, Jinting, Sugahara, Tohru, Wang, Jun, Vanfleteren, Jan, Sekitani, Tsuyoshi, Suganuma, Katsuaki

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Determination of Parameters of Electron Transport in Dye-Sensitized Solar Cells Using Electrochemical Impedance Spectroscopy von Adachi, Motonari, Sakamoto, Masaru, Jiu, Jinting, Ogata, Yukio, Isoda, Seiji

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In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste von Zhang, Hao, Gao, Yue, Jiu, Jinting, Suganuma, Katsuaki

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Efficient assembly of high-performance reduced graphene oxide/silver nanowire transparent conductive film based on in situ light-induced reduction technology von Li, Lingying, Li, Wanli, Jiu, Jinting, Suganuma, Katsuaki

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Bonding technology based on solid porous Ag for large area chips von Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device von Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates von Ding, Su, Tian, Yanhong, Jiu, Jinting, Suganuma, Katsuaki

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Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere von Gao, Yue, Li, Wanli, Chen, Chuantong, Zhang, Hao, Jiu, Jinting, Li, Cai-Fu, Nagao, Shijo, Suganuma, Katsuaki

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Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method von Araki, Teppei, Jiu, Jinting, Nogi, Masaya, Koga, Hirotaka, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices von Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Sugahara, Tohru, Zhang, Hao, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

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Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres von Gao, Yue, Zhang, Hao, Li, Wanli, Jiu, Jinting, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

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One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices von Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

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High-intensity pulse light sintering of silver nanowire transparent films on polymer substrates: the effect of the thermal properties of substrates on the performance of silver fil... von Jiu, Jinting, Sugahara, Tohru, Nogi, Masaya, Araki, Teppei, Suganuma, Katsuaki, Uchida, Hiroshi, Shinozaki, Kenji

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Intense pulsed light-induced structure-transformed ultrathin Ni shell for improving the chemical, thermal, and electrical reliability of metal nanowire electrodes without transmitt... von Li, Lingying, Li, Wanli, Tong, Ke, Jiu, Jinting, Suganuma, Katsuaki

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The rise of conductive copper inks: challenges and perspectives von Li, Wanli, Sun, Qingqing, Li, Lingying, Jiu, Jinting, Liu, Xu-Ying, Kanehara, Masayuki, Minari, Takeo, Suganuma, Katsuaki

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Self-healing of cracks in Ag joining layer for die-attachment in power devices von Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

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Highly conductive copper films based on submicron copper particles/copper complex inks for printed electronics: Microstructure, resistivity, oxidation resistance, and long-term sta... von Li, Wanli, Li, Lingying, Gao, Yue, Hu, Dawei, Li, Cai-Fu, Zhang, Hao, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

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Direct fabrication of high-resolution and high-performance flexible electronics via surface-activation-localized electroless plating von Li, Wanli, Li, Lingying, Sun, Qingqing, Liu, Xuying, Kanehara, Masayuki, Nakayama, Tomonobu, Jiu, Jinting, Sakamoto, Kenji, Minari, Takeo

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