Ag-graphene hybrid conductive ink for writing electronics von Xu, L Y, Yang, G Y, Jing, H Y, Wei, J, Han, Y D

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Pressure-assisted low-temperature sintering for paper-based writing electronics von Xu, L Y, Yang, G Y, Jing, H Y, Wei, J, Han, Y D

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Interfacial reaction between n- and p-type thermoelectric materials and SAC305 solders von Zhang, H., Jing, H.Y., Han, Y.D., Xu, L.Y., Lu, G-Q.

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Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes von Han, Y. D., Nai, S. M. L., Jing, H. Y., Xu, L. Y., Tan, C. M., Wei, J.

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Creep behavior of eutectic 80Au/20Sn solder alloy von Zhang, G.S., Jing, H.Y., Xu, L.Y., Wei, J., Han, Y.D.

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes von Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., Wei, J.

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The characteristics of placental transfer and tissue concentrations of nickel in late gestational rats and fetuses von Hou, Y.-P, Gu, J.-Y, Shao, Y.-F, Song, Y.-F, Jing, Y.-H, Wu, W.-S, Pu, S

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Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders von Xu, L. Y., Zhang, Z. K., Jing, H. Y., Wei, J., Han, Y. D.

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Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder von Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.

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Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints von Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., Wei, J.

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Effect of graphene nanosheets reinforcement on the performance of SnAgCu lead-free solder von Liu, X.D., Han, Y.D., Jing, H.Y., Wei, J., Xu, L.Y.

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Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation von Han, Y.D., Gao, Y., Zhang, S.T., Jing, H.Y., Wei, J., Zhao, L., Xu, L.Y.

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Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder von Han, Y. D., Chen, L., Jing, H. Y., Nai, S. M. L., Wei, J., Xu, L.Y.

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A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints von Han, Y D, Jing, H Y, Nai, S M L, Tan, C M, Wei, J, Xu, L Y, Zhang, S R

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X-ray Reflectivity Study on the Structure and Phase Stability of Mixed Phospholipid Multilayers von Jing, H. Y, Hong, D. H, Kwak, B. D, Choi, D. J, Shin, K, Yu, C.-J, Kim, J. W, Noh, D. Y, Seo, Y. S

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Effects of deep cryogenic treatment on the residual stress and mechanical properties of electron-beam-welded Ti–6Al–4V joints von Xu, L.Y., Zhu, J., Jing, H.Y., Zhao, L., Lv, X.Q., Han, Y.D.

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Effect of welding on the corrosion behavior of X65/Inconel 625 in simulated solution von Xu, L. Y., Jing, H. Y., Han, Y. D.

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Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers von Jing, H.Y., Guo, H.J., Wang, L.X., Wei, J., Xu, L.Y., Han, Y.D.

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Indentation Size Effect on Ag Nanoparticle-Modified Graphene/Sn-Ag-Cu Solders von Xu, L. Y., Zhang, S. T., Jing, H. Y., Wang, L. X., Wei, J., Kong, X. C., Han, Y. D.

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Experimental evidence of the “dead layer” at Pt∕BaTiO3 interface von Li, X. L., Chen, B., Jing, H. Y., Lu, H. B., Zhao, B. R., Mai, Z. H., Jia, Q. J.

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