Surface Laminar Circuit (TM) carrier and flip chip assembly enabling technologies for advanced computer applications von Jimarez, M.

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Evolution of a unique flip-chip MCM-L package von Jimarez, M.A., Son Tran, Le Coz, C., Dearing, G.O.

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Technical evaluation of a near chip scale size flip chip/plastic ball grid array package von Jimarez, M., Li Li, Tytran, C., Loveland, C., Obrzut, J.

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Evolution of a unique flip chip MCM-L package von Jimarez, M., Tran, S., Lecoz, C., Dearing, G.

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New Robust Process Improvement for BGA Solder Ball Attach First Pass Yield von Sy, H.G., Hsu, J., Jimarez, M.

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TIM degradation in flip chip packages von Islam, N., Seo Won Lee, Jimarez, M., Joon Yeob Lee, Galloway, J.

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Study of FCMBGA with low CTE core substrate von Boo Yang Jung, Jae Yun Gim, Min Yoo, Jae Dong Kim, Choon Heung Lee, Jimarez, M., Islam, N., Darveaux, R.

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Development of large die fine pitch flip chip BGA using TCNCP technology von Yanggyoo Jung, Minjae Lee, Sunwoo Park, Dongsu Ryu, Youshin Jung, Chanha Hwang, Choonheung Lee, Sungsoon Park, Jimarez, M., Myung-June Lee

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Comparison between the persistence of post COVID-19 symptoms on critical patients requiring invasive mechanical ventilation and non-critical patients von Irisson-Mora, Irene, Salgado-Cordero, Angélica M, Reyes-Varón, Estefanía, Cataneo-Piña, Daniela J, Fernández-Sánchez, Mónica, Buendía-Roldán, Ivette, Salazar-Lezama, Miguel A

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Aluminum thick-metal-backed circuits: conductive adhesive technology von Light, D.N., Jimarez, L.J., Egitto, F.D., Matienzo, L.J., Logan, P.E., Seman, A.M.

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Method of attaching a conformal chip carrier to a flip chip von Cokely, David N, Culnane, Thomas M, Jimarez, Lisa J, Jimarez, Miguel A, Li, Li, Mead, Donald I

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Fixture for attaching a conformal chip carrier to a flip chip von Cokely, David N, Culnane, Thomas M, Jimarez, Lisa J, Jimarez, Miguel A, Li, Li, Mead, Donald I

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Method of attaching a conformal chip carrier to a flip chip von JIMAREZ MIGUEL A, JIMAREZ LISA J, LI LI, CULNANE THOMAS M, MEAD DONALD I, COKELY DAVID N

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Method and apparatus for assembling a conformal chip carrier to a flip chip von JIMAREZ MIGUEL A, JIMAREZ LISA J, LI LI, CULNANE THOMAS M, MEAD DONALD I, COKELY DAVID N

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Fixture for attaching a conformal chip carrier to a flip chip von JIMAREZ MIGUEL A, JIMAREZ LISA J, LI LI, CULNANE THOMAS M, MEAD DONALD I, COKELY DAVID N

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METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A FLIP CHIP von JIMAREZ MIGUEL A, JIMAREZ LISA J, LI LI, CULNANE THOMAS M, MEAD DONALD I, COKELY DAVID N

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METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A FLIP CHIP von CULNANE, THOMAS M, COKELY, DAVID N, JIMAREZ, LISA J, JIMAREZ, MIGUEL A, LI, LI, MEAD, DONALD I

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Process of heat treating and annealing CIC and CIC created thereby von Japp, Robert M, Jimarez, Lisa J, McClure, Bonnie S

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Process of heat treating and annealing CIC and CIC created thereby von JAPP ROBERT M, MCCLURE BONNIE S, JIMAREZ LISA J

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Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers von JIMAREZ MIGUEL A, REISS MATTHEW M, SATHE SANJEEV B, WOYCHIK CHARLES G, DARBHA KRISHNA

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