Targeting BMP2 for therapeutic strategies against hepatocellular carcinoma von Li, Ping, Shang, You, Yuan, Liying, Tong, Jialing, Chen, Quan

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Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers von Jialing Tong, Sato, Yoichiro, Panayappan, Kadappan, Sundaram, Venky, Peterson, Andrew F., Tummala, Rao R.

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Via-First Process to Enable Copper Metallization of Glass Interposers With High-Aspect-Ratio, Fine-Pitch Through-Package-Vias von Huang, Timothy B., Chou, Bruce, Jialing Tong, Ogawa, Tomonori, Sundaram, Venky, Tummala, Rao R.

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Credit risk pricing under fuzzy mixed fractional Brownian motion von Wei, Caimin, Tong, Jialing, He, Wenwen, Zhang, Maojun

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Hyperion: Artificial gravity reusable crewed deep space transport von Minster, Gedi, Chang, Alexander, Inouye, Jacob Banner, Narayanan, Sriram, Carter, Austin, Tong, Jialing, Barnhart, David A.

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Thermal runaway prediction based on electrothermal models in nanotechnologies von Jialing Tong, Xiaochun Li, Junfa Mao

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Modeling and analysis of electrothermal effects on global ULSI interconnects von Xiaochun Li, Jialing Tong, Yan Shao, Junfa Mao

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Temperature-dependent device behavior in advanced CMOS technologies von Xiaochun Li, Jialing Tong, Junfa Mao

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The network analysis of chiral cascaded circuit and its novel application on directional coupler von Xin Mi Yang, Jialing Tong, Weikeng Qin, Tie Jun Cui

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Gradient index metamaterials based on dielectric disks von Di Bao, Weikeng Qin, Jialing Tong, Xin Mi Yang, Qiang Cheng, Tie Jun Cui

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DRY ETCH BACK SUBSTRATE INTERCONNECTIONS von KANG, Kuiwon, TONG, Jialing, BUOT, Joan Rey Villarba

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Integrated circuit (IC) package with stacked die wire bond connections, and related methods von Kim, Michelle Yejin, Tong, Jialing, Kang, Kuiwon, Buot, Joan Rey Villarba

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INTEGRATED CIRCUIT PACKAGE WITH STACKED INTEGRATED CIRCUIT DIES AND METHOD OF FABRICATING THE SAME von KANG, Kuiwon, KIM, Michelle Yejin, TONG, Jialing, BUOT, Joan Rey Villarba

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INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTIONS, AND RELATED METHODS von Kim, Michelle Yejin, Tong, Jialing, Kang, Kuiwon, Buot, Joan Rey Villarba

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INTEGRATED CIRCUIT PACKAGE WITH STACKED INTEGRATED CIRCUIT DIES AND METHOD OF FABRICATING THE SAME von KANG, Kuiwon, KIM, Michelle Yejin, TONG, Jialing, BUOT, Joan Rey Villarba

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High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer von Sundaram, Venky, Tong, Jialing, Demir, Kaya, Huang, Timothy, Shorey, Aric, Pollard, Scott, Tummala, Rao

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적층된 집적 회로 다이들을 갖는 집적 회로 패키지 및 그를 제조하는 방법 von TONG JIALING, KANG KUIWON, BUOT JOAN REY VILLARBA, KIM MICHELLE YEJIN

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PACOTE DE CIRCUITO INTEGRADO COM MATRIZES DE CIRCUITO INTEGRADO EMPILHADAS E MÉTODO DE FABRICAÇÃO DO MESMO von KUIWON KANG, JIALING TONG, MICHELLE YEJIN KIM, JOAN REY VILLARBA BUOT

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Use of adenosine-phosphate-activated protein kinase (AMPK) agonist 7-methoxyisoflavone in preparation of medicament for treating allergic diseases and/or autoimmune diseases von HAO YUANYUAN, ZHANG YINGYING, MOU CHANG, CUI XUETING, GE FENG, CAI LEI, FANG RUINING, LIN SENSEN, TONG JIALING, LI CHENGJING, GU XINYUE, CAI-XI YUNYI, QIAN HONGFA, WU YATING, DONG HAO, TONG YUE, WU LIANG, WU SHUTING

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Application of AMPK agonist MK-8722 in preparing drugs for treating allergic diseases von HAO YUANYUAN, ZHANG YINGYING, MOU CHANG, CUI XUETING, GE FENG, CAI LEI, FANG RUINING, LIN SENSEN, TONG JIALING, LI CHENGJING, GU XINYUE, QIAN HONGFA, WU YATING, DONG HAO, TONG YUE, WU LIANG, WU SHUTING, CAI XIYUNGE

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