Microstructure Study of Electrochemically Driven LixSi von Son, Seoung-Bum, Trevey, James E., Roh, Hyunchul, Kim, Sung-Hwan, Kim, Kee-Bum, Cho, Jong Soo, Moon, Jeong-Tak, DeLuca, Christopher M., Maute, Kurt K., Dunn, Martin L., Han, Heung Nam, Oh, Kyu Hwan, Lee, Se-Hee

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An All-Solid-State Li-Ion Battery with a Pre-Lithiated Si-Ti-Ni Alloy Anode von Yersak, Thomas A., Son, Seoung-Bum, Cho, Jong Soo, Suh, Soon-Sung, Kim, Young-Ugk, Moon, Jeong-Tak, Oh, Kyu Hwan, Lee, Se-Hee

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Relationship between microstructure homogeneity and bonding stability of ultrafine gold wire von Son, Seoung-Bum, Roh, Hyunchul, Kang, Suk Hoon, Chung, Hee-Suk, Kim, Do Hyun, Choi, Yong Seok, Cho, Jong Soo, Moon, Jeong-Tak, Oh, Kyu Hwan

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A numerical approach on the inclusion effects in ultrafine gold wire drawing process von Son, Seoung-Bum, Lee, Young Kwang, Kang, Suk Hoon, Chung, Hee-Suk, Cho, Jong Soo, Moon, Jeong-Tak, Oh, Kyu Hwan

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Breakup behavior of a molten metal jet von Oh, Yong Suk, Choi, Dong Yun, Son, Jae Yeol, Kim, Bo Young, Kang, Hyun Wook, Chang, Cheong Bong, Moon, Jeong-Tak, Sung, Hyung Jin

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Symmetric miniaturized heating system for active microelectronic devices von McCracken, Michael, Mayer, Michael, Jourard, Isaac, Moon, Jeong-Tak, Persic, John

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반도체 패키징용 금-코팅된 은 와이어의 부식특성 von 홍원식, Won Sik Hong, 김미송, Mi-song Kim, 김상엽, Sang Yeop Kim, 전성민, Sung Min Jeon, 문정탁, Jeong Tak Moon, 김영식, Youngsik Kim

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Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability von GAM, Sang-Ah, KIM, Hyoung-Joon, CHO, Jong-Soo, PARK, Yong-Jin, MOON, Jeong-Tak, PAIK, Kyung-Wook

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Reliability study of low cost alternative Ag bonding wire with various bond pad materials von Kyung-Ah Yoo, Chul Uhm, Tae-Jin Kwon, Jong-Soo Cho, Jeong-Tak Moon

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Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability von Yong-Sung Park, Yong-Min Kwon, Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, Kyung-Wook Paik

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Assessing Au-Al wire bond reliability using integrated stress sensors von McCracken, Michael J, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon

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Pd effects on the reliability in the low cost Ag bonding wire von Jong-Soo Cho, Kyeong-Ah Yoo, Sung-Jae Hong, Jeong-Tak Moon, Yong-Je Lee, Wongil Han, Hanki Park, Seung-Weon Ha, Seong-Bum Son, Suk-Hoon Kang, Kyu-Hwan Oh

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Thermal reliability & IMC behavior of low cost alternative Au-Ag-Pd wire bonds to Al metallization von Jong-Soo Cho, Hee-Suk Jeong, Jeong-Tak Moon, Se-Jin Yoo, Jae-Seok Seo, Seung-Mi Lee, Seung-Weon Ha, Eun-Kyu Her, Suk-Hoon Kang, Kyu-Hwan Oh

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Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability von Yong-Sung Park, Yong-Min Kwon, Jeong-Tak Moon, Young-Woo Lee, Jae-Hong Lee, Kyung-Wook Paik

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Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage von Ji-Won Shin, Min-Suk Song, Yong-Sung Park, Yong-Min Kwon, Jeong-Tak Moon, Jong-Soo Cho, Kyung-Ah Yoo, Kwan-Yoo Byun, Cheol-Ho Joh, Eun-Hye Do, Kyung-Wook Paik

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A Highly Reversible Nano-Si Anode Enabled by Mechanical Confinement in an Electrochemically Activated Li sub(x)Ti sub(4)Ni sub(4)Si sub(7) Matrix von Son, Seoung-Bum, Kim, Seul Cham, Kang, Chan Soon, Yersak, Thomas A, Kim, Yoon-Chang, Lee, Chun-Gyoo, Moon, Sung-Hwan, Cho, Jong Soo, Moon, Jeong-Tak, Oh, Kyu Hwan, Lee, Se-Hee

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Microstructure Study of Electrochemically Driven Li x Si von Son, Seoung‐Bum, Trevey, James E., Roh, Hyunchul, Kim, Sung‐Hwan, Kim, Kee‐Bum, Cho, Jong Soo, Moon, Jeong‐Tak, DeLuca, Christopher M., Maute, Kurt K., Dunn, Martin L., Han, Heung Nam, Oh, Kyu Hwan, Lee, Se‐Hee

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A study on early degradation phenomena in Au-Al ball bonds von Jong-Soo Cho, Jin-Yong Kim, Jeong-Tak Moon, Eun-Kyu Her, Kyu-Hwan Oh

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Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish von Yong-Sung Park, Yong-Min Kwon, Ho-Young Son, Jeong-Tak Moon, Byung-Wook Jeong, Kyung-In Kang, Kyung-Wook Paik

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Anode active material for secondary battery and method of manufacturing the same von BAE JAE HAN, LEE KI KANG, MOON JEONG TAK

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