Improvement of high entropy alloy nitride coatings (AlCrNbSiTiMo)N on mechanical and high temperature tribological properties by tuning substrate bias von Lo, Wei-Li, Hsu, Sheng-Yu, Lin, Yu-Chia, Tsai, Su-Yueh, Lai, Yuan-Tai, Duh, Jenq-Gong

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Improving the hardness of high entropy nitride (Cr0.35Al0.25Nb0.12Si0.08V0.20)N coatings via tuning substrate temperature and bias for anti-wear applications von Lin, Yu-Chia, Hsu, Sheng-Yu, Song, Rui-Wen, Lo, Wei-Li, Lai, Yuan-Tai, Tsai, Su-Yueh, Duh, Jenq-Gong

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Mechanical strengthening in self-lubricating CrAlN/VN multilayer coatings for improved high-temperature tribological characteristics von Wang, Yin, Lee, Jyh-Wei, Duh, Jenq-Gong

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Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints von Chen, Hao, Chou, Tzu-Ting, Fleshman, Collin, Duh, Jenq-Gong

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Shell-by-Shell Synthesis and Applications of Carbon-Coated SnO2 Hollow Nanospheres in Lithium-Ion Battery von Lin, Yu-Sheng, Duh, Jenq-Gong, Hung, Min-Hsiu

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Rational design of a synthetic strategy, carburizing approach and pore-forming pattern to unlock the cycle reversibility and rate capability of micro-agglomerated LiMn0.8Fe0.2PO4 c... von Wang, Yan, Cheng-Yu, Wu, Yang, Hao, Jenq-Gong Duh

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Correlation between microstructure evolution and mechanical strength in the Sn–3.0Ag–0.5Cu/ENEPIG solder joint von Tseng, Chien-Fu, Duh, Jenq-Gong

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Kinetic Study of High Voltage Spinel Cathode Material in a Wide Temperature Range for Lithium Ion Battery von Jin, Yi-Chun, Duh, Jenq-Gong

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The Variation of Microstructure and the Improvement of Shear Strength in SAC1205-xNi/OSP Cu Solder Joints Before and After Aging von Fleshman, Collin, Duh, Jenq-Gong

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Facile synthesis of mesoporous lithium titanate spheres for high rate lithium-ion batteries von Lin, Yu-Sheng, Duh, Jenq-Gong

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Nano-to-Microdesign of Marimo-Like Carbon Nanotubes Supported Frameworks via In-spaced Polymerization for High Performance Silicon Lithium Ion Battery Anodes von Huang, Yao-Hui, Bao, Qi, Chen, Bing-Hong, Duh, Jenq-Gong

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Ultrahigh-frequency ferromagnetic properties of FeCoHf films deposited by gradient sputtering von Li, Shandong, Huang, Zhigao, Duh, Jenq-Gong, Yamaguchi, Masahiro

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Effects of Plasma-Activated Water via Different Gas Treatments on Coffee Ground Decomposition von Chan, Yun-Chen, Lai, Yuan-Tai, Hsu, Sheng-Yu, Chen, Po-Yu, Duh, Jenq-Gong

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Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages von Chou, Tzu-Ting, Fleshman, Collin Jordon, Chen, Hao, Duh, Jenq-Gong

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Plasma-Treated Soybean Dregs Solution With Various Gas Mixtures von Ku, Tsai-Ni, Hsu, Sheng-Yu, Lai, Yuan-Tai, Chang, Shou-Yi, Duh, Jenq-Gong

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Effect of Plasma Treatment on Ice Plant Germination and Physicochemical Surface Using Dielectric Barrier Discharge von Chen, Tzu-Ling, Lai, Yuan-Tai, Hsu, Sheng-Yu, Chang, Shou-Yi, Hung, Hsueh-Hsing, Duh, Jenq-Gong

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Stabilization of hexagonal Cu6(Sn,Zn)5 by minor Zn doping of Sn-based solder joints von Yu, Chi-Yang, Duh, Jenq-Gong

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Improving the impact toughness of Sn–Ag–Cu/Cu–Zn Pb-free solder joints under high speed shear testing von Yu, Chi-Yang, Chen, Wei-Yu, Duh, Jenq-Gong

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Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging von Wu, Zih-You, Wang, Tzu-Chia, Wang, Yu-Ching, Song, Rui-Wen, Tsai, Su-Yueh, Duh, Jenq-Gong

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A facile approach to derive binder protective film on high voltage spinel cathode materials against high temperature degradation von Chou, Wei-Yu, Jin, Yi-Chun, Duh, Jenq-Gong, Lu, Cheng-Zhang, Liao, Shih-Chieh

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