Exfoliated, thin, flexible germanium heterojunction solar cell with record FF=58.1 von Onyegam, E.U., Sarkar, D., Hilali, M., Saha, S., Rao, R.A., Mathew, L., Jawarani, D., Mantey, J., Ainom, M., Garcia, R., James, W., Banerjee, S.K.

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Statistical analysis of early failures in electromigration von Gall, M., Capasso, C., Jawarani, D., Hernandez, R., Kawasaki, H., Ho, P. S.

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The relation between phase transformation and onset of thermal degradation in nanoscale CoSi2-polycrystalline silicon structures von van Dal, M. J. H., Jawarani, D., van Berkum, J. G. M., Kaiser, M., Kittl, J. A., Vrancken, C., de Potter, M., Lauwers, A., Maex, K.

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Back-contact solar cells in thin crystalline silicon von Fossum, J G, Sarkar, D, Mathew, L, Rao, R, Jawarani, D, Law, M E

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Detection and analysis of early failures in electromigration von Gall, M., Capasso, C., Jawarani, D., Hernandez, R., Kawasaki, H., Ho, P. S.

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Electromigration in multilevel interconnects with polymeric low- k interlevel dielectrics von Justison, P., Ogawa, E., Ho, P. S., Gall, M., Capasso, C., Jawarani, D., Wetzel, J., Kawasaki, H.

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Electromigration failure model: its application to W plug and Al-filled vias von Kawasaki, H, Gall, M, Jawarani, D, Hernandez, R, Capasso, C

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In situ transmission electron microscopy study of plastic deformation and stress-induced voiding in Al–Cu interconnects von Jawarani, D., Kawasaki, H., Yeo, I.-S., Rabenberg, L., Stark, J. P., Ho, P. S.

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In situ transmission electron microscopy study of plastic deformation in passivated Al–Cu thin films von Jawarani, D., Kawasaki, H., Yeo, I.-S., Rabenberg, L., Stark, J. P., Ho, P. S.

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A novel low cost 25μm thin exfoliated monocrystalline Si solar cell technology von Rao, R. A., Mathew, L., Saha, S., Smith, S., Sarkar, D., Garcia, R., Stout, R., Gurmu, A., Onyegam, E., Ahn, D., Xu, D., Jawarani, D., Fossum, J., Banerjee, S.

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Void-free chemically vapor-deposited aluminum dual inlaid metallization schemes for ultra-large-scale-integrated via and interconnect applications von Ong, T. P., Fiordalice, R., Venkatraman, R., Garcia, S., Jain, A., Sparks, T., Farkas, J., Fernandes, M., Gall, M., Jawarani, D., Klein, J., Weitzman, E., Kawasaki, H., Wu, Wei, Blumenthal, R., Pintchovski, F., Marsh, R., Zhang, P., Zhang, H., Guo, T., Mosely, R.

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Intermetallic Compound Formation in Ti/Al Alloy Thin Film Couples and Its Role in Electromigration Lifetime von Jawarani, D., Stark, J. P., Kawasaki, H., Olowolafe, J. O., Lee, C. C., Klein, J., Pintchovski, F.

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Mechanical strength and reliability of a novel thin monocrystalline silicon solar cell von Dewei Xu, Ho, P. S., Rao, R. A., Mathew, L., Smith, S., Saha, S., Sarkar, D., Vass, C., Jawarani, D.

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Exfoliated sub-10μm thin germanium for cost-effective germanium based photovoltaic applications von Onyegam, E. U., Mantey, J., Rao, R. A., Mathew, L., Hilali, M., Saha, S., Jawarani, D., Smith, S., Ferrer, D. A., Sreenivasan, S. V., Banerjee, S. K.

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A low cost kerfless thin crystalline Si solar cell technology von Rao, R. A., Mathew, L., Sarkar, D., Smith, S., Saha, S., Garcia, R., Stout, R., Gurmu, A., Ainom, M., Onyegam, E., Xu, D., Jawarani, D., Fossum, J., Banerjee, S., Das, U., Upadhyaya, A., Rohatgi, A., Wang, Q.

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Exfoliated thin, flexible monocrystalline germanium heterojunction solar cells von Onyegam, E. U., Sarkar, D., Hilali, M., Saha, S., Rao, R., Mathew, L., Jawarani, D., James, W., Mantey, J., Ainom, M., Garcia, R., Banerjee, S. K.

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Critical discussion of relevant physical issues surrounding the weeping of nuclear-waste casks von Jawarani, D., Stark, J.P., Nichols, S.P.

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Effect of interface layer on the microstructure and electromigration resistance of Al-Si-Cu alloy on TiN/Ti substrates von OLOWOLAFE, J. O, KAWASAKI, H, LEE, C. C, KLEIN, J, PINTCHOVSKI, F, JAWARANI, D

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Dual Silicide SOI CMOS Integration with Low-Resistance PtSi PMOS Contacts von Zollner, S., Grudowski, P., Thean, A., Jawarani, D., Karve, G., White, T., Bolton, S., Desjardins, H., Chowdhury, M., Kyuhwan Chang, Jahanbani, M., Noble, R., Lovejoy, L., Rossow, M., Denning, D., Goedeke, D., Filipiak, S., Garcia, R., Raymond, M., Dhandapani, V., Da Zhang, Laegu Kang, Crabtree, P., Zhu, X., Kottke, M.L., Gregory, R., Fejes, P., Wang, X.-D., Theodore, D., Taylor, W.J., Bich-Yen Nguyen

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Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics von Justison, P., Ogawa, E., Gall, M., Capasso, C., Jawarani, D., Wetzel, J., Kawasaki, H., Ho, P.S.

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