Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties von Vianco, Paul T., McKenzie, Bonnie B., Rejent, Jerome A., Grazier, J. Mark, Jaramillo, Celedonio E., Kilgo, Alice C.

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Microstructural Coarsening Kinetics and Mechanical Property Changes in Long-Term Aged Sn–Pb–Sb Solder Joints von Susan, D. F., Wheeling, R. A., Williams, S. M., Yang, J., Jaramillo, C. E.

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