Stress control of sputtered W film using W/WN multilayer von Han, Dong-Hoon, Bae, Jong-yong, Park, Se Jun, Jung, Won-Ki, Kim, Ho Jun, Won, Jaihyung

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Effect of deposition temperature and thermal annealing on the dry etch rate of a-C: H films for the dry etch hard process of semiconductor devices von Lee, Seung Moo, Won, Jaihyung, Yim, Soyoung, Park, Se Jun, Choi, Jongsik, Kim, Jeongtae, Lee, Hyeondeok, Byun, Dongjin

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Photothermal fixation of laser-trapped polymer microparticles on polymer substrates von Won, Jaihyung, Inaba, Takanori, Masuhara, Hiroshi, Fujiwara, Hideki, Sasaki, Keiji, Miyawaki, Shigeru, Sato, Setsuya

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Comparative study on the properties of amorphous carbon layers deposited from 1-hexene and propylene for dry etch hard mask application in semiconductor device manufacturing von Lee, Seungmoo, Won, Jaihyung, Choi, Jongsik, Park, Jihun, Jee, Yeonhong, Lee, Hyeondeok, Byun, Dongjin

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Preparation and analysis of amorphous carbon films deposited from (C 6H 12)/Ar/He chemistry for application as the dry etch hard mask in the semiconductor manufacturing process von Lee, Seungmoo, Won, Jaihyung, Choi, Jongsik, Jang, Samseok, Jee, Yeonhong, Lee, Hyeondeok, Byun, Dongjin

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Structural study of chemical-vapor-deposited diamond surface by high-resolution electron microscopy von NAN JIANG, HATTA, A, JAIHYUNG WON, MORI, Y, ITO, T, SASAKI, T, HIRAKI, A

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Influence of Annealing Condition on TSV Pumping and Microstructure Evolution von Jing, Xiangmeng, Lee, Ui-Hyoung, Xu, Cheng, Niu, Zhongcai, Song, Chongshen, Zhang, Wenqi, Bae, Jong-yong, Won, Jaihyung

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The investigation of defect formation in chemical vapor deposited diamond using photoluminescence by ultraviolet synchrotron radiation von Won, Jaihyung, Hatta, Akimitsu, Ito, Toshimichi, Sasaki, Takatomo, Hiraki, Akio

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Investigation of distribution of defects and impurities in boron-doped CVD diamond film by cathodoluminescence spectroscopy von Wang, Chunlei, Hatta, Akimitsu, Jiang, Nan, Won, Jaihyung, Ito, Toshimichi, Hiraki, Akio, Jin, Zengsun, Zou, Guangtian

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FILM DEPOSITION APPARATUS von WON, Jaihyung, LEE, Naeil, LIM, Hyonam, PARK, Taehoon, PARK, Jinhyung, BAIK, Choonkum

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성막 장치 von LEE NAEIL, BAIK CHOONKUM, PARK TAEHOON, WON JAIHYUNG, LIM HYONAM, PARK JINHYUNG

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Fabrication of Uniform Sized Metal Spheres by Plasma Induced Dewetting von Han, Dong-Hoon, Lee, Seung Moo, Lee, Jung-Joong, Kim, Dohyung, Choi, Jinho, Won, Jaihyung

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Influence of Annealing Condition on TSV Pumping and Microstructure Evolution von Jing, Xiangmeng, Lee, Ui-Hyoung, Xu, Cheng, Niu, Zhongcai, Song, Chongshen, Zhang, Wenqi, Bae, Jong-yong, Won, Jaihyung

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A Study of Photo Resist Compatibility to Copper Bath during Applied Current von Lee, Ui-Hyoung, Park, Ho-Nyun, Morishima, Yuji, Hatsukade, Tomoko, Takahashi, Takuya, Choi, Jinho, Won, Jaihyung

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Methods of forming a hard mask layer and of fabricating a semiconductor device using the same von Choi Gyuwan, Roh Sangho, Won Jaihyung, Shin Eunsol, Kim Dohyung, Lee Seung Moo, Park Sejun

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FILM FORMATION DEVICE von WON, Jaihyung, LEE, Naeil, LIM, Hyonam, PARK, Taehoon, PARK, Jinhyung, BAIK, Choonkum

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A Study of Adopting Pure Tin Solder to Pillar Bump von Lee, Ui-Hyoung, Cho, Moongi, Choi, Woojin, You, Ha-Young, Choi, Jinho, Won, Jaihyung

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In-Situ Analysis of Peg Surface Adhesion On Cu von Lee, Ui-Hyoung, Choi, Jinho, Won, Jaihyung, Lee, Hyo-Jong, Sohn, Hun-Joon, Kang, Tak

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Apparatus for and method of processing substrate von Lee Uihyoung, Won Jaihyung, Choi Jinho, Kim Jinhyoung, Lee Sanghyun, Lee Donghyun

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Comparison of Cu-Sn Compound Formation Between Snag and Pure Sn Solder Bumps by EBSD von Lee, Ui-Hyoung, Lee, Hyo-Jong, Kim, Sang-Hyuk, Park, Chae-Min, Shin, Han Kyun, Bae, Jong-yong, Won, Jaihyung

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