Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects von Jacobs, Kristof J. P., Beyne, Eric

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Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy von Jacobs, Kristof J. P., Stucchi, Michele, Beyne, Eric

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Reliability of p-GaN Gate HEMTs in Reverse Conduction von Cingu, Deepthi, Li, Xiangdong, Bakeroot, Benoit, Amirifar, Nooshin, Geens, Karen, Jacobs, Kristof J. P., Zhao, Ming, You, Shuzhen, Groeseneken, Guido, Decoutere, Stefaan

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Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects von De Wolf, Ingrid, Jacobs, Kristof J.P, Orozco, Antonio

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Novel Structural Designs for Engineering Terahertz Emitting Resonant Tunnelling Diodes von Baba, Razvan, Jacobs, Kristof J.P., Stevens, Benjamin J., Mukai, Toshikazu, Hogg, Richard A.

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Reliability of p-GaN Gate HEMTs in Reverse Conduction von Cingu, Deepthi, Li, Xiangdong, Bakeroot, Benoit, Amirifar, Nooshin, Geens, Karen, Jacobs, Kristof J.P, Zhao, Ming, You, Shuzhen, Groeseneken, Guido, Decoutere, Stefaan

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Characterization of through-silicon vias using laser terahertz emission microscopy von Jacobs, Kristof J. P., Murakami, Hironaru, Murakami, Fumikazu, Serita, Kazunori, Beyne, Eric, Tonouchi, Masayoshi

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Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects von Jacobs, Kristof J. P., Li, Yunlong, Stucchi, Michele, De Wolf, Ingrid, Van Huylenbroeck, Stefaan, De Vos, Joeri, Beyne, Eric

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Photoluminescence Characterisation of High Current Density Resonant Tunnelling Diodes for Terahertz Applications von JACOBS, Kristof J. P., STEVENS, Benjamin J., HOGG, Richard A.

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METHOD OF DETECTING MANUFACTURING DEFECTS BY THERMAL STIMULATION von De Wolf, Ingrid, Jacobs, Kristof J.P

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