Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix von Biswas, Shantonu, Schoeberl, Andreas, Hao, Yufei, Reiprich, Johannes, Stauden, Thomas, Pezoldt, Joerg, Jacobs, Heiko O.

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Self-assembly of microscopic chiplets at a liquid-liquid-solid interface forming a flexible segmented monocrystalline solar cell von Knuesel, Robert J, Jacobs, Heiko O

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A First Implementation of an Automated Reel-to-Reel Fluidic Self-Assembly Machine von Park, Se-Chul, Fang, Jun, Biswas, Shantonu, Mozafari, Mahsa, Stauden, Thomas, Jacobs, Heiko O.

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Core–Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects von Kaltwasser, Mahsa, Schmidt, Udo, Biswas, Shantonu, Reiprich, Johannes, Schlag, Leslie, Isaac, Nishchay Angel, Stauden, Thomas, Jacobs, Heiko O

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Three-dimensional platinum nanoparticle-based bridges for ammonia gas sensing von Isaac, Nishchay A., Reiprich, Johannes, Schlag, Leslie, Moreira, Pedro H. O., Baloochi, Mostafa, Raheja, Vishal A., Hess, Anna-Lena, Centeno, Luis F., Ecke, Gernot, Pezoldt, Jörg, Jacobs, Heiko O.

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Approaching Roll-to-Roll Fluidic Self-Assembly: Relevant Parameters, Machine Design, and Applications von Se-Chul Park, Jun Fang, Biswas, Shantonu, Mozafari, Mahsa, Stauden, Thomas, Jacobs, Heiko O.

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Submicrometer Patterning of Charge in Thin-Film Electrets von Jacobs, Heiko O., Whitesides, George M.

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Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries von Biswas, Shantonu, Mozafari, Mahsa, Stauden, Thomas, Jacobs, Heiko O

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Three-Dimensional MoS2 Nanosheet Structures: CVD Synthesis, Characterization, and Electrical Properties von Mathew, Sobin, Reiprich, Johannes, Narasimha, Shilpashree, Abedin, Saadman, Kurtash, Vladislav, Thiele, Sebastian, Hähnlein, Bernd, Scheler, Theresa, Flock, Dominik, Jacobs, Heiko O., Pezoldt, Jörg

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Energy‐Efficient Operation Conditions of MoS2‐Based Memristors von Kurtash, Vladislav, Jacobs, Heiko O., Pezoldt, Jörg

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Fabrication of a Cylindrical Display by Patterned Assembly von Jacobs, Heiko O., Tao, Andrea R., Schwartz, Alexander, Gracias, David H., Whitesides, George M.

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Self‐Aligning Metallic Vertical Interconnect Access Formation through Microlensing Gas Phase Electrodeposition controlling Airgap and Morphology von Schlag, Leslie, Isaac, Nishchay A., Hossain, Mohammad M., Hess, Anna‐Lena, Wolz, Benedikt C., Reiprich, Johannes, Ziegler, Mario, Pezoldt, Jörg, Jacobs, Heiko O.

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Sequential Shape-and-Solder-Directed Self-Assembly of Functional Microsystems von Zheng, Wei, Buhlmann, Philippe, Jacobs, Heiko O., Whitesides, George M.

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Effective Collection and Detection of Airborne Species Using SERS-Based Detection and Localized Electrodynamic Precipitation von Lin, En-Chiang, Fang, Jun, Park, Se-Chul, Stauden, Thomas, Pezoldt, Joerg, Jacobs, Heiko O.

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Gas Phase Electrodeposition: A Programmable Multimaterial Deposition Method for Combinatorial Nanostructured Device Discovery von Lin, En-Chiang, Cole, Jesse J, Jacobs, Heiko O

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Tri-Gate Al0.2Ga0.8N/AlN/GaN HEMTs on SiC/Si-Substrates von Baumann, Uwe, Jatal, Wael, Pezoldt, Joerg, Jacobs, Heiko O., Schwierz, Frank

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Defects Contributing to Hysteresis in Few-Layer and Thin-Film MoS2 Memristive Devices von Abedin, Saadman, Kurtash, Vladislav, Mathew, Sobin, Thiele, Sebastian, Jacobs, Heiko O., Pezoldt, Jörg

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Self-Assembly and Self-Tiling: Integrating Active Dies Across Length Scales on Flexible Substrates von Knuesel, R. J., Sechul Park, Wei Zheng, Jacobs, H. O.

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Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points von Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O.

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Ultrafast formation of single phase B2 AlCoCrFeNi high entropy alloy films by reactive Ni/Al multilayers as heat source von Wang, Anni, Gallino, Isabella, Riegler, Sascha Sebastian, Lin, Yi-Ting, Isaac, Nishchay A., Sauni Camposano, Yesenia Haydee, Matthes, Sebastian, Flock, Dominik, Jacobs, Heiko O., Yen, Hung-Wei, Schaaf, Peter

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