증류탑 최적 설계를 위한 경험 법칙 제시 및 자동화 von 채현엽, Hyunyeob Chae, 이종민, Jongmin Lee, 정광섭, Kwangseop Jung

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Poly(3-pentadecylphenyl acrylate) having a bottlebrush-like structure for high-performance middle distillate flow improver von Kim, Sangwan, Baik, Ji-Hoon, Hong, Dong Gi, Kim, Woo Hyun, Jung, Kwangseop, Lee, Jong-Chan

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COMPOUND FOR COLD FLOW IMPROVER AND COLD FLOW IMPROVER COMPRISING THE SAME von JUNG KWANGSEOP, HONG DONGGI, LEE JONGCHAN, KIM WOOHYUN, SHIN YUNSUB, KIM SANGWAN

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ADDITIVES FOR FUEL AND METHOD OF FORMING THE SAME von JUNG KWANGSEOP, BAIK JIHOON, HONG DONGGI, LEE JONGCHAN, KIM WOOHYUN, SHIN YUNSUB, KIM SANGWAN

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Carrier film for transferring microelement von Lee, Hak Joo, Kim, Kwangseop, Jung, Hyun June, Kim, Chan, Yoon, Min Ah, Kim, Jae Hyun

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CARRIER FILM FOR TRANSFERRING MICROELEMENT von LEE, Hak Joo, JUNG, Hyun June, KIM, Jae Hyun, KIM, Chan, YOON, Min Ah, KIM, Kwangseop

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Method and apparatus for transferring micro device, and electronic product using the same von Jang, Bongkyun, Kim, Kwangseop, Yoon, Sung Uk, Kim, Kyung-Sik, Kim, Jung Yup, Choi, Byung-Ik, Kim, Jae-Hyun, Hwangbo, Yun, Kim, Chang Hyun, Kim, Sang Min

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METHOD AND APPARATUS FOR TRANSFERRING MICRO DEVICE, AND ELECTRONIC PRODUCT USING THE SAME von KIM, Jae-Hyun, KIM, Sang Min, HWANGBO, Yun, KIM, Chang Hyun, CHOI, Byung-Ik, YOON, Sung Uk, KIM, Jung Yup, KIM, Kyung-Sik, KIM, Kwangseop, JANG, Bongkyun

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Active vibration reduction device of machine tool and method thereof von BO MIN KANG, YOONSIK KWON, JUN YOUNG YOON, SANG WON JUNG, EUN KYU KIM, JAE WOO JUNG, KWANGSEOP SIM, CHANGHO LEE, OK HYUN JO

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Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board von CHO MINJUNG, SHIN YOUNGHWAN, JUNG BONGHIE, YOON KYOUNGRO, YOUM KWANGSEOP

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CARRIER FILM FOR TRANSFERRING MICROELEMENT von LEE, Hak Joo, JUNG, Hyun June, KIM, Jae Hyun, KIM, Chan, YOON, Min Ah, KIM, Kwangseop

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MICRO DEVICE TRANSFER METHOD AND TRANSFER APPARATUS, AND ELECTRONIC PRODUCT USING SAME von KIM KWANGSEOP, JANG BONGKYUN, HWANGBO YUN, YOON SUNG UK, KIM KYUNG SIK, CHOI BYUNG IK, KIM SANG MIN, KIM CHANG HYUN, KIM JUNG YUP, KIM JAE HYUN

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Method and apparatus for transferring micro device, and electronic product using the same von KIM, CHANG HYUN, KIM, KWANGSEOP, CHOI, BYUNG-IK, KIM, SANG MIN, HWANGBO, YUN, YOON, SUNG UK, KIM, JAE-HYUN, JANG, BONGKYUN, KIM, KYUNG-SIK, KIM, JUNG YUP

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MICRO DEVICE TRANSFER METHOD AND TRANSFER APPARATUS, AND ELECTRONIC PRODUCT USING SAME von KIM, Sang Min, HWANGBO, Yun, KIM, Jae Hyun, KIM, Chang Hyun, CHOI, Byung Ik, YOON, Sung Uk, KIM, Jung Yup, KIM, Kwangseop, KIM, Kyung Sik, JANG, Bongkyun

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MICRO-ELEMENT TRANSFER DEVICE AND MICRO-ELEMENT TRANSFER METHOD von KIM, Jae-Hyun, LEE, Hak Joo, HWANGBO, Yun, KIM, Chang-Hyun, CHOI, Byung-Ik, YOON, Sung Uk, KIM, Kyung-Sik, KIM, Jung Yup, KIM, Kwangseop, JANG, Bongkyun

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MICRO-DEVICE TRANSFER METHOD AND MICRO-DEVICE TRANSFER APPARATUS von KIM, Jae-Hyun, LEE, Hak Joo, LEE, Seung-Mo, HWANGBO, Yun, PARK, Hyun-Sung, CHOI, Byung-Ik, YOON, Sung Uk, KIM, Kyung-Sik, KIM, Jung Yup, KIM, Kwangseop, JANG, Bongkyun

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Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board von CHO MINJUNG, SHIN YOUNGHWAN, JUNG BONGHIE, YOON KYOUNGRO, YOUM KWANGSEOP

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