Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications von Fang Yu, Jinzi Cui, Zhangming Zhou, Kun Fang, Johnson, R. Wayne, Hamilton, Michael C.

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Pressureless Sintering of Microscale Silver Paste for 300 °C Applications von Fang Yu, Johnson, R. Wayne, Hamilton, Michael C.

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Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module von Gess, Joshua, Bhavnani, Sushil, Wayne Johnson, R

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Durability of Low Melt Alloys as Thermal Interface Materials von Roy, Chandan K, Bhavnani, Sushil, Hamilton, Michael C, Wayne Johnson, R, Knight, Roy W, Harris, Daniel K

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Characterization of Bi-Ag-X Solder for High Temperature SiC Die Attach von Zhenzhen Shen, Kun Fang, Johnson, R. Wayne, Hamilton, Michael C.

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Investigation into the application of low melting temperature alloys as wet thermal interface materials von Roy, Chandan K., Bhavnani, Sushil, Hamilton, Michael C., Johnson, R. Wayne, Nguyen, Jonathan L., Knight, Roy W., Harris, Daniel K.

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Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials von Peacock, Melissa A., Roy, Chandan K., Hamilton, Michael C., Wayne Johnson, R., Knight, Roy W., Harris, Daniel K.

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Method for determining frequency dependent thermomechanical behavior of polymer films at cryogenic temperatures von Bonning, Bo, Stretz, Holly A., Wilson, Christopher D., Johnson, Wayne R.

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Mechanical Reliability of Thick Films for High-Temperature Packaging von Zhou, Zhangming, Johnson, R. Wayne, Hamilton, Michael C.

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Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300 °C Applications von Fang Yu, Johnson, R. Wayne, Hamilton, Michael C.

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Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation von Raj, Anto, Sanders, Thomas, Sridhar, Sharath, Evans, John L., Bozack, Michael J., Johnson, Wayne R., Carpenter, D. Mark

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Conductive Mechanism of Bi-Doped Thick-Film Dielectric in High-Temperature Aging With Bias von Zhangming Zhou, Johnson, R. Wayne, Hamilton, Michael C.

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Superposition-based predictions of creep for polymer films at cryogenic temperatures von Bonning, Bo, Blackburn, C. Jordan, Stretz, Holly A., Wilson, Christopher D., Johnson, Wayne R.

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Reliability of Die Attach on DBC Substrates With Different Ni Surface Finishes Using BiAgX Solder von Cui, Jinzi, Johnson, R. Wayne, Hamilton, Michael C.

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Reliability of AuGe Die Attach on DBC Substrates With Different Ni Surface Finishes von Jinzi Cui, Johnson, R. Wayne, Hamilton, Michael C.

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Evaluation of Thick-Film Materials for High-Temperature Packaging von Zhangming Zhou, Jinzi Cui, Fang Yu, Johnson, R. Wayne, Hamilton, Michael C.

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Thin-Film Flip-Chip Assembly for High- Temperature Geothermal Application von Kun Fang, Fang Yu, Johnson, R. Wayne, Hamilton, Michael C.

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Optimization of lead free solder 01005 component assembly von Liu, Yueli, Wayne Johnson, R

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Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications von Zhenzhen Shen, Teng Xu, Johnson, R. Wayne, Hamilton, Michael C.

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Component Attachment with Pressureless Ag Sintering for 300°C Applications von Yu, Fang, Cui, Jinzi, Zhou, Zhangming, Johnson, R. Wayne, Hamilton, Michael C.

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