Highly Stretchable, Elastic, and Ionic Conductive Hydrogel for Artificial Soft Electronics von Zhou, Yang, Wan, Changjin, Yang, Yongsheng, Yang, Hui, Wang, Shancheng, Dai, Zhendong, Ji, Keju, Jiang, Hui, Chen, Xiaodong, Long, Yi

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Fabrication and electromagnetic interference shielding performance of open-cell foam of a Cu–Ni alloy integrated with CNTs von Ji, Keju, Zhao, Huihui, Zhang, Jun, Chen, Jia, Dai, Zhendong

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Electrodeposited lead-foam grids on copper-foam substrates as positive current collectors for lead-acid batteries von Ji, Keju, Xu, Chen, Zhao, Huihui, Dai, Zhendong

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Effect of interconnected metal skeletons on the tribological properties of polyurethane elastomers von Wen, Mingcai, Tang, Yiqiang, Yuan, Cong, Cui, Enhua, Ji, Keju, Dai, Zhendong

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A Neural Coordination Strategy for Attachment and Detachment of a Climbing Robot Inspired by Gecko Locomotion von Wang, Bingcheng, Wang, Zhouyi, Song, Yifan, Zong, Weijia, Zhang, Linghao, Ji, Keju, Manoonpong, Poramate, Dai, Zhendong

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Fabrication of Flexible Multi-Cavity Bio-Inspired Adhesive Unit Using Laminated Mold Pouring von Zhang, Linghao, Wang, Liuwei, Weng, Zhiyuan, Yuan, Qingsong, Ji, Keju, Wang, Zhouyi

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Resistance reduction of patterned surface inspired by cuticle structure of Achalinus spinalis von Zhao, Jiahui, Ji, Keju, Chen, Qin, Khan, Muhammad Niaz, Tu, Chongwen, Ma, Ze, Wu, Jianming, Chen, Jian, Dai, Zhendong

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Effective metal mold method for the production of bionic adhesives based on electrochemical modifications von YUAN, Cong, JI, Keju, TANG, Yiqiang, WANG, Zizhuo, CUI, Enhua, CHEN, Jian, DAI, Zhendong

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Preload‐Induced Switchable Adhesion von Tu, Chongwen, Ji, Keju, Zhao, Jiahui, Wang, Xipeng, Wu, Jianming, Huo, Tingwei, Ji, Yuanming, Chen, Jian, Deng, Kai, Dai, Zhendong

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The highly stable air-operating ionic polymer metal composite actuator with consecutive channels and its potential application in soft gripper von He, Qingsong, Liu, Zhigang, Yin, Guoxiao, Yue, Yinghao, Yu, Min, Li, Hongkai, Ji, Keju, Xu, Xianrui, Dai, Zhendong, Chen, Meng

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Biomimetic Microstructure with Anti-Slip and Anti-Adhesion for Efficient Handling of Brittle Material Surfaces in High-Temperature Environments von Zhan, Haozhen, Wu, Jianming, Zhang, Jiachun, Li, Qianqian, Fu, Shixun, Chen, Jian, Zhao, Jiahui, Ji, Yuanming, Wang, Xipeng, Deng, Kai, Ji, Keju

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Influence of carbon dioxide plasma treatment on the dry adhesion of vertical aligned carbon nanotube arrays von Lu, Mingyue, He, Qingsong, Li, Yang, Xu, Chi, Ji, Keju, Dai, Zhendong

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A deep-learning-assisted versatile electret sensor for moving object detection von Wang, Linfeng, Hu, Minhao, Kong, Kaixuan, Tao, Jing, Ji, Keju, Dai, Zhendong

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Manufacturing of Bionic Adhesion Microstructure with Expanded Ends Based on Electroplating in the Restricted Area von Li, Qianqian, Ji, Keju, Zhao, Jiahui, Zou, Peng, Wang, Xipeng, Chen, Jian, Li, Conghui, Li, Zhili, Deng, Kai, Ji, Yuanming, Li, Yinghui, Dai, Zhendong

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Biomimetic Patch with Wicking-Breathable and Multi-mechanism Adhesion for Bioelectrical Signal Monitoring von Zhang, Qian, Ji, Keju, Huo, Tingwei, Khan, Muhammad Niaz, Hu, Zhuoyang, Yuan, Cong, Zhao, Jiahui, Chen, Jian, Wang, Zhouyi, Dai, Zhendong

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A three-dimensional porous metal foam with selective-wettability for oil–water separation von Zhang, Jun, Ji, Keju, Chen, Jia, Ding, Yafei, Dai, Zhendong

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Influence of vibrations and shocks on the stability of biomimetic attachments von Wang, Xipeng, Ji, Keju, Fu, Shixun, Tu, Chongwen, Wu, Jianming, Huo, Tingwei, Zhao, Jiahui, Ji, Yuanming, Deng, Kai, Tan, Haoran, Dai, Zhendong

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Synergetic adhesion in highly adaptable bio-inspired adhesive von Khan, Muhammad Niaz, Huo, Tingwei, Zhang, Qian, Hu, Zhuoyang, Zhao, Jiahui, Chen, Jian, Wang, Zhouyi, Ji, Keju

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Insect-inspired design strategy for flexible attachments with strong frictional force and weak pull-off force von Zhao, Jiahui, Ji, Keju, Tu, Chongwen, Deng, Kai, Wang, Liuwei, Chen, Jian, Wu, Jianming, Zhu, Junjie, Bai, Hemin, Dai, Zhendong

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Bio-inspired anti-slip and anti-adhesion surface with hemispherical microstructures for wafer handling von Wu, Jianming, Ji, Keju, Liu, Shaobao, Huo, Tingwei, Wang, Xipeng, Tu, Chongwen, Zhao, Jiahui, Deng, Kai, Dai, Zhendong, Gorb, Stanislav N.

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