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  1. 1
    Under bump metallization structure and method for forming the same and redistribution metallization structure

    Under bump metallization structure and method for forming the same and redistribution metallization structure von CHEN, HSINCHI, JENG, CHICHERNG, HWANG, YUANKO, LEE, CHIHFEI, CHANG, FUCHENG

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  2. 2
    Image sensor and method for manufacturing thereof

    Image sensor and method for manufacturing thereof von HUANG, WANCHEN, HUANG, YINCHIEH, JENG, CHICHERNG, CHOU, CHUNHAO, LEE, KUOCHENG, CHENG, YUNWEI, LIU, ZHEJU

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  3. 3
    METAL GATE STACK HAVING TIALCN AS WORK FUNCTION LAYER AND/OR BLOCKING/WETTING LAYER

    METAL GATE STACK HAVING TIALCN AS WORK FUNCTION LAYER AND/OR BLOCKING/WETTING LAYER von JENG CHICHERNG, LIU CHI WEN, JANGJIAN SHIU KO, WANG TINGCHUN

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