Simulation-based design and experimental evaluation of a spatially controllable CVD reactor von Choo, Jae-Ouk, Adomaitis, Raymond A., Rubloff, Gary W., Henn-Lecordier, Laurent, Liu, Yijun

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Multiplexed mass spectrometry for real-time sensing in a spatially programmable chemical vapor deposition reactor von Cai, Yuhong, Henn-Lecordier, Laurent, Rubloff, Gary W., Sreenivasan, Ramaswamy, Choo, Jae-Ouk, Adomaitis, Raymond A.

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Modeling and simulation of a sulfolane extraction process von Choo, Jae-Ouk, Yeo, Yeong-Koo, Kim, Myung-Kil, Kim, Ki-Sung, Chang, Kun-Soo

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A new approach to spatially controllable CVD von Jae-Ouk Choo, Adomaitis, R.A., Rubloff, G.W., Henn-Lecordier, L., Yuhong Cai

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Design, Simulation, and Experimental Testing of a Spatially Controllable CVD Reactor von Choo, Jae-Ouk, Adomaitis, Raymond A., Rubloff, Gary W., Henn-Lecordier, Laurent, Liu, Yijun

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CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR SHALLOW TRENCH ISOLATION (STI) APPLICATIONS AND METHODS OF MAKING THEREOF von Hughes, John Edward Quincy, Choo, Jae Ouk, Nbach, Laura Lede, Usmani, Saifi, Mungai, Martin Kamau Ngigi, Castillo, II, Daniel Hernandez, Winchester, Steven Charles, Schlueter, James Allen, Marsella, John Anthony, Shi, Xiaobo, Zhou, Hongjun, Schwartz, Jo-Ann Theresa

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Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications von SCHLUETER JAMES ALLEN, SHI XIAOBO, MURELLA KRISHNA, CHOO JAE OUK

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Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications von SCHLUETER JAMES ALLEN, SHI XIAOBO, MURELLA KRISHNA, CHOO JAE OUK

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Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications von SCHLUETER JAMES ALLEN, SHI XIAOBO, MURELLA KRISHNA, CHOO JAE OUK

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Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications von SCHLUETER JAMES ALLEN, SHI XIAOBO, MURELLA KRISHNA, CHOO JAE OUK

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Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications von SCHLUETER, JAMES ALLEN, MURELLA, KRISHNA P, SHI, XIAOBO, CHOO, JAE OUK

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Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof von Hughes, John Edward Quincy, Choo, Jae Ouk, Usmani, Saifi, Mungai, Martin Kamau Ngigi, Castillo, II, Daniel Hernandez, Winchester, Steven Charles, Schlueter, James Allen, Marsella, John Anthony, Shi, Xiaobo, Ledenbach, Laura, Zhou, Hongjun, Schwartz, Jo-Ann Theresa

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Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications von SCHLUETER, JAMES ALLEN, MURELLA, KRISHNA P, SHI, XIAOBO, CHOO, JAE OUK

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CMP method providing reduced thickness variations von Yoon, Ilyoung, Choo, Jae Ouk, Koo, JaEung

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CMP method providing reduced thickness variations von CHOO JAE OUK, KOO JAEUNG, YOON ILYOUNG

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Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof von SCHWARTZ JO-ANN THERESA, USMANI SAIFI, SCHLUETER JAMES ALLEN, WINCHESTER STEVEN CHARLES, HUGHES JOHN EDWARD QUINCY, SHI XIAOBO, CASTILLO, II DANIEL HERNANDEZ, CHOO JAE OUK, MUNGAI MARTIN KAMAU NGIGI, MARSELLA JOHN ANTHONY, LEDENBACH LAURA, ZHOU HONGJUN

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Fabrication method of semiconductor device having reduced thickness variations and semiconductor device fabricated using the same von YOON ILYOUNG,CHOO JAE OUK,KOO JAEUNG

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CMP method providing reduced thickness variations von CHOO JAE OUK, KOO JAEUNG, YOON ILYOUNG

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Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof von SCHWARTZ JO-ANN THERESA, USMANI SAIFI, SCHLUETER JAMES ALLEN, WINCHESTER STEVEN CHARLES, HUGHES JOHN EDWARD QUINCY, SHI XIAOBO, CASTILLO, II DANIEL HERNANDEZ, CHOO JAE OUK, MUNGAI MARTIN KAMAU NGIGI, MARSELLA JOHN ANTHONY, LEDENBACH LAURA, ZHOU HONGJUN

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Chemical Mechanical Polishing (CMP) Composition for Shallow Trench Isolation (STI) Applications and Methods of Making Thereof von SCHWARTZ JO-ANN THERESA, USMANI SAIFI, SCHLUETER JAMES ALLEN, WINCHESTER STEVEN CHARLES, HUGHES JOHN EDWARD QUINCY, SHI XIAOBO, CASTILLO, II DANIEL HERNANDEZ, CHOO JAE OUK, MUNGAI MARTIN KAMAU NGIGI, MARSELLA JOHN ANTHONY, LEDENBACH LAURA, ZHOU HONGJUN

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