Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2022, 14-15 September, Langkawi, Malaysia von Mohd Salleh, Mohd Arif Anuar, Che Halin, Dewi Suriyani, Abdul Razak, Kamrosni, Ramli, Mohd Izrul Izwan

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Synthesis of Kaolin Geopolymer as Ceramic Reinforcement in Lead-Free Solder von Mohamad Zaimi, Nur Syahirah, Izwan Ramli, Mohd Izrul, Mohd Salleh, Mohd Arif Anuar, Bakri Abdullah, Mohd Mustafa Al, Chaiprapa, Jitrin, Abdul Aziz, Mohd Shahrizal

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Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints von Somidin, Flora, Natasha Ilias, Nur Fatin, Mohamad Zaimi, Nur Syahirah, Izwan Ramli, Mohd Izrul, Abdul Razak, Nurul Razliana

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The Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin-Based Geopolymer Ceramic von Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri, Aziz, Ikmal Hakem, Ying, Tan Chi, Shahedan, Noor Fifinatasha, Kockelmann, Winfried, Fedrigo, Anna, Sandu, Andrei Victor, Vizureanu, Petrica, Chaiprapa, Jitrin, Burduhos Nergis, Dumitru Doru

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Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review von Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri, Zaimi, Nur Syahirah Mohamad, Sandu, Andrei Victor, Vizureanu, Petrica, Rylski, Adam, Amli, Siti Farahnabilah Muhd

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International Conference on Electronic and Advanced Materials 2021 von Saud, Norainiza, Bakar, Sharifah Shahnaz Syed, Ramli, Mohd Izrul Izwan, Nazeri, Muhammad Firdaus Mohd

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Mixed Assembly of Lead-free Solder Joint: A Short Review von Said, Rita Mohd, Salleh, Mohd Arif Anuar Mohd, Ramli, Mohd Izrul Izwan, Saud, Norainiza, Somidin, Flora, Razak, Nurul Razliana Abdul, Ismail, Anis Nadhirah

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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow von Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki, Sandu, Ioan Gabriel

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Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing von Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Amli, Siti Farahnabilah Muhd, Said, Rita Mohd, Saud, Norainiza, Abdullah, Mohd Mustafa Al Bakri, Vizureanu, Petrica, Rylski, Adam, Chaiprapa, Jitrin, Nabialek, Marcin

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An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite von Norainiza Saud, Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, Derman, Mohd Nazree, Mohd Izrul Izwan Ramli, Norhayanti Mohd Nasir

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy von Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Al Bakri Abdullah, Mohd Mustafa, Ramli, Mohd Izrul Izwan

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Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints von Mokhtar, Noor Zaimah Mohd, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Ramli, Muhammad Mahyiddin, Chaiprapa, Jitrin, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan

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MICROSTRUCTURE AND INTERFACIAL INTERMETALLIC OF Sn-3.0Ag-0.5Cu/Sn-58Bi SOLDER JOINT FOR PACKAGE-ON-PACKAGE TECHNOLOGY von RAMLI, Mohd Izrul Izwan, MOHD SAID, Rita, SOMIDIN, Flora, MUHD AMLI, Siti Farahnabilah, MUSTAPHA, Siti Nor Atirah

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Superconducting Lead-free Solder Joint: A Short Review von Said, Rita Mohd, Salleh, Mohd Arif Anuar Mohd, Saud, Norainiza, Ramli, Mohd Izrul Izwan

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Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging von Ramli, Mohd Izrul Izwan, Saud, Norainiza, Mohd Salleh, Mohd Arif Anuar, Said, Rita Mohd

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OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS von RAMLI, Mohd Izrul Izwan, MUHD AMLI, Siti Farahnabilah, SAUD, Norainiza, CHE HALIN, Dewi Suriyani, MD FAUZI, Nur Akrimi Maswa

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The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint von Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Said, Rita Mohd, Abdullah, Mohd Mustafa Al Bakri, Halin, Dewi Suriyani Che, Saud, Norainiza, Nabiałek, Marcin

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Microstructure Evolution of Ag/TiO2 Thin Film von Halin, Dewi Suriyani Che, Razak, Kamrosni Abdul, Mohd Salleh, Mohd Arif Anuar, Ramli, Mohd Izrul Izwan, Abdullah, Mohd Mustafa Al Bakri, Azhari, Ayu Wazira, Nogita, Kazuhiro, Yasuda, Hideyuki, Nabiałek, Marcin, Wysłocki, Jerzy J.

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Wettability and thermal properties of Sn-0.7Cu- 0.05Ni-xZn solder alloy von Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Saleh, Nurul Ashikin, Amli, Siti Farahnabilah Muhd

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Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows von Mohd Salleh, Mohd Arif Anuar, Said, Rita Mohd, Ramli, Mohd Izrul Izwan, Amran, Nur Ain Athirah

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