A Tissue-specific Long Noncoding RNA Controls Homologous Recombination in Prostate Cancer von Feng, F.Y, Prensner, J.R, Chen, W, Iyer, M.K, Cao, Q, Wilder-Romans, K, Lawrence, T.S, Chinnaiyan, A.M

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Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards von Jingook Kim, Rotaru, M.D., Seungyong Baek, Jongbae Park, Iyer, M.K., Kim, Joungho

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Novel circuit model for three-dimensional geometries with multilayer dielectrics von Jayabalan, J., Ooi, B.-L., Leong, M.-S., Iyer, M.K.

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Asymmetric waveguides vertical couplers for polarization-independent coupling and polarization-mode splitting von Chee-Wei Lee, Chin, M.-K., Iyer, M.K., Popov, A.

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Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages von Zhang, H.Y., Pinjala, D., Joshi, Y.K., Wong, T.N., Toh, K.C., Iyer, M.K.

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RNASTAR: an RNA STructural Alignment Repository that provides insight into the evolution of natural and artificial RNAs von Widmann, Jeremy, Stombaugh, Jesse, McDonald, Daniel, Chocholousova, Jana, Gardner, Paul, Iyer, Matthew K, Liu, Zongzhi, Lozupone, Catherine A, Quinn, John, Smit, Sandra, Wikman, Shandy, Zaneveld, Jesse R R, Knight, Rob

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Addressing packaging challenges von Adam, J., Chi Shih Chang, Stankus, J.J., Iyer, M.K., Chen, W.T.

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Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs von Junwoo Lee, Rotaru, M.D., Iyer, M.K., Hyungsoo Kim, Kim, Joungho

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Three-dimensional system-in-package using stacked silicon platform technology von Kripesh, V., Seung Wook Yoon, Ganesh, V.P., Khan, N., Rotaru, M.D., Wang Fang, Iyer, M.K.

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Monte Carlo simulation studies of sidewall roughening during reactive ion etching von PANI, S. K, TJIPTOHARSONO, F, WONG, C. C, PREMACHANDRAN, C. S, RAMAMA, P. V, IYER, M. K

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Modeling of simultaneous switching noise in high speed systems von Sungjun Chun, Swaminathan, M., Smith, L.D., Srinivasan, J., Zhang Jin, Iyer, M.K.

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Fabrication of buried hybrid sol–gel optical waveguides by femtosecond laser direct writing von Pani, S.K., Quiling, Y., Wong, C.C., Low, D.K.Y., Zhang, X., Iyer, M.K.

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Integrated Process-Aging Modeling Methodology for Flip Chip on Flex Interconnections With Nonconductive Adhesives von Xiaowu Zhang, Wong, E.H., Rajoo, R., Iyer, M.K., Caers, J., Zhao, X.J.

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An Efficient Sequential SAT Solver With Improved Search Strategies von Lu, F., Iyer, M. K., Parthasarathy, G., Wang, L.-C., Cheng, K.-T., Chen, K. C.

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Safety property verification using sequential SAT and bounded model checking von Parthasarathy, G., Iyer, M.K., Cheng, K.-T., Wang, L.-C.

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A Novel Test Strategy for Fine Pitch Wafer-Level Packaged Devices von Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ban-Leong Ooi, Mook-Seng Leong

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Determining the minimum number of arrayed waveguides and the optimal orientation angle of slab for the design of arrayed waveguide gratings von Zhou, Jun, Ngo, Nam Quoc, Pita, K., Kam, C.H., Ramana, P.V., Iyer, M.K.

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An efficient finite-domain constraint solver for circuits von Parthasarathy, G., Iyer, M. K., Cheng, K.-T., Wang, L.-C.

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A self-test methodology for IP cores in bus-based programmable SoCs von Jing-Reng Huang, Iyer, M.K., Kwang-Ting Cheng

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Design and development of optoelectronic mixed signal system-on-package (SOP) von Iyer, M.K., Ramana, P.V., Sudharsanam, K., Leo, C.J., Sivakumar, M., Bryan Lee Sik Pong, Xie Ling

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