Customer Acceptance of Telecommunication Technologies During Pre-Launch Stage von Iyer, CK. S. S., Patil, Sunil, Chetlapalli, Vijayalakshmi

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Patient Reported Clinical Outcomes Following PCL Suture Augmentation in Patients with Multiligamentous Knee Injury: A Retrospective Observational Study von Fathi, Amir, Thompson, Ashley A, Bolia, Ioanna K, Mayfield, Cory K, Korber, Shane S, Iyer, Avinash, Hatch Iii, George F

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Global, regional, and national life expectancy, all-cause mortality, and cause-specific mortality for 249 causes of death, 1980-2015: a systematic analysis for the Global Burden of... von Wang, H, Carter, A, Erskine, HE, Johnson, C, Kinfu, Y, Lim, SS, Zoeckler, L, Ajala, ON, Alemu, ZA, Asayesh, H, Asghar, RJ, Balakrishnan, K, Barker-Collo, SL, Basu, S, Beardsley, J, Bell, ML, Bhalla, A, Biroscak, BJ, Bohensky, MA, Chen, W, Choi, J-YJ, Cirillo, M, Colquhoun, SM, Davey, G, Diaz-Torne, C, Dos Santos, KPB, Bartholow, B, Esteghamati, A, Faghmous, IDA, Sa Farinha, CSE, Farzadfar, F, Fitchett, JRA, Hirst, T, Futran, ND, Ganguly, P, Gebre, T, Gebrehiwot, TT, Giroud, M, Gupta, R, Halasa, YA, Hamadeh, RR, Handal, AJ, Hsairi, M, Jensen, PN, Jiang, Y, Jonas, JB, Karletsos, D, Kayibanda, JF, Kesavachandran, CN, Muthafer Khoja, TA, Krog, NH, Kudom, AA, Kumar, GA, Lal, A, Langan, SM, Lansingh, VC, Liu, PY, Liu, S, Pedro Machado, VM, Abd El Razek, HM, Majeed, A, Margolis, DJ, Mckee, M, Mehndiratta, MM, Melaku, YA, Micha, R, Mirarefin, M, Monasta, L, Naidoo, KS, Nejjari, C, Neupane, S, Nomura, M, Ojelabi, FA, Stokic, LP, Quame-Amaglo, J, Rahimi, K, Rahimi-Movaghar, V, Rahman, M, Rana, SM, Blancas, MJR, Saha, S, Shi, P, Shiri, R, Sigfusdottir, ID, Silverberg, JI, Sposato, LA, Takala, JS, Thorne-Lyman, AL, Thrift, AG, Tillmann, T, Tirschwell, DL, Topouzis, F, Tura, AK, Ukwaja, KN, Van Dingenen, R, Vijayakumar, L, White, RA, Xu, G, Zaidi, Z, Zaki, MES

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Global, regional, and national incidence, prevalence, and years lived with disability for 310 diseases and injuries, 1990–2015: a systematic analysis for the Global Burden of Disea... von Charlson, FJ, Fleming, T, Kemmer, L, Marczak, L, Olsen, H, Rankin, Z, Abbas, KM, Abd-Allah, F, Abraham, B, Ademi, Z, Agarwal, A, Alegretti, MA, Alemu, ZA, Altirkawi, KA, Avokpaho, EFGA, Quintanilla, BPA, Barrero, LH, Bensenor, IM, Betsu, BD, Blore, J, Boufous, S, Rivas, JC, Chowdhury, R, Christensen, H, Das Neves, J, Davis, AC, Driscoll, TR, Feigin, VL, Fernandes, JC, Geleijnse, JM, Gibney, KB, Hailu, AD, Hankey, GJ, Hay, RJ, Hoy, DG, Huynh, C, Karimkhani, C, Kemp, AH, Khader, YS, Khang, Y, Kim, P, Knudsen, AK, Kokubo, Y, Defo, BK, Bicer, BK, Kumar, GA, Lam, JO, Leung, R, Liu, S, Mackay, MT, Majeed, A, McGarvey, ST, McKee, M, Melaku, YA, Mills, EJ, Mitchell, PB, Mohammadi, A, Montico, M, Moradi-Lakeh, M, Murdoch, ME, Nagel, G, Nguyen, QL, Pete, PMN, Ohkubo, T, Olusanya, JO, Ortiz, A, Osman, M, Patten, SB, Patton, GC, Pishgar, F, Pond, CD, Radfar, A, Rafay, A, Rahman, SU, Ram, U, Resnikoff, S, Rothenbacher, D, Roy, A, Sanabria, JR, Santos, IS, Sawhney, M, Sepanlou, SG, Shaheen, A, Shepard, DS, Singh, JA, Singh, OP, Stathopoulou, V, Steel, N, Tandon, N, Tavakkoli, M, Tura, AK, Uneke, CJ, Wagner, GR, Weichenthal, S, White, RA, Wubshet, M, Yano, Y, Yaseri, M, Yebyo, HG, Younis, MZ

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Evaluation of a replication-competent VSV-SIV vaccine candidate von Jurgens, CK, Morrow, G, Boggiano, C, Panis, M, Coleman, J, Powell, R, Yuan, M, Kemelman, M, Tamot, N, Lopez, M, Ouattara, A, Iyer, S, Backer, M, Wright, K, Domi, A, Chiuchiolo, M, King, CR, Caulfield, M, Parks, C

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Skull drill with auto-stop function and related systems and methods von IYER ARAVIND B, AHLBU CK, MARTIN, N.D.ANDREWS, NAGY, MUSTAFA, KADIR, CHERYL, M, PANIAN, TODD

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Thermopower of 2122 thallium high temperature superconductors von Radhakrishnan, Vijayashree, Subramaniam, C.K., Srinivasan, R., Gopalakrishnan, I.K., Sastry, P.V.P.S.S., Yakmi, J.V., Iyer, R.M.

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X-ray damage considerations in MOSFET devices von MALDONADO, J. R, REISMAN, A, LEZEC, H, WILLIAMS, C. K, IYER, S. S

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Free air or colon? von Iyer, Shridar G, Leow, CK

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Assembly and reliability performance of flip chip with no-flow underfills von Chua Khoon Lam, Lee, C.

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Physical failure analysis to distinguish EOS and ESD failures von Tung Chih Hang, Cheng Cheng Kou, Radhakrishnan, M.K., Iyer, N.M.

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High density fine pitch Pb-free flip-chip interconnect assembly von Lim, S.P.-S., Chua Khoon Lam, Lee, C., Poi-Siong Teo

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Solder imprint technology: A reverse growth of intermetallic compound at the interface to fix the brittle interfacial fracture of BGA package soldered on Ni/Au plating von Chung, C.K., Leong, K.F., Sim, K.S.

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Microdetermination of hydroxyl groups via esterification with succinic and o-sulfobenzoic anhydrine von Narang, C.K., Iyer, V., Mathur, N.K.

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