Synonymous codon substitutions perturb cotranslational protein folding in vivo and impair cell fitness von Walsh, Ian M., Bowman, Micayla A., Santarriaga, Iker F. Soto, Rodriguez, Anabel, Clark, Patricia L.

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Recapitulating protein vectorial appearance enhances folding to the native structure in vitro von Santarriaga, Iker F. Soto, Clark, Patricia L.

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The ClpX translocase and its application to the study of vectorial protein folding in vitro von Soto Santarriaga, Iker F., Clark, Patricia L.

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Thin films stress extraction using micromachined structures and wafer curvature measurements von Laconte, J., Iker, F., Jorez, S., André, N., Proost, J., Pardoen, T., Flandre, D., Raskin, J.-P.

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Three-Dimensional Self-Assembled Sensors in Thin-Film SOI Technology von Iker, F., Andre, N., Pardoen, T., Raskin, J.-P.

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Bulk and surface micromachined MEMS in thin film SOI technology von Raskin, J.-P., Iker, F., André, N., Olbrechts, B., Pardoen, T., Flandre, D.

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Steady-state measurement of wafer bonding cracking resistance von Bertholet, Y., Iker, F., Raskin, J.P., Pardoen, T.

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CMOS compatible 3-D self assembled microstructures using thin film SOI technology von Iker, F., Si Moussa, M., Andre, N., Pardoen, T., Raskin, J.-P.

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Bulk and surface micromachined MEMS in thin film SOI technolog von Raskin, J-P, Iker, F, Andre, N, Olbrechts, B, Pardoen, T, Flandre, D

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Alternative patterning techniques enabling fine pitch interconnection on topography surfaces von Iker, F, Funaya, T, Jamieson, G, Beyne, E

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A Descum Review for Cleaning Surfaces in Polymer Embedded Process Flows von Gerets, C., Pham, N.P., Boullart, Werner, Iker, F., Jamieson, G., Funaya, T., Duval, F.C.

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Diamond bit cutting for processing high topography wafers von Agarwal, R., Pham, N., Cotrin, R., Andrei, A., Ruythooren, W., Iker, F., Soussan, P.

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Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies von Iker, F., Funaya, T., Teixeira, R.C., Ruythooren, W.

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Ultra thin die embedding technology with 20μm-pitch interconnection von Funaya, T, Buisson, T, De Preter, I, Beyne, E, Iker, F

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One-Mask CMOS Compatible Process for the Fabrication of Three-Dimensional Self-Assembled Thin-Film SOI Microelectromechanical Systems von Iker, F., André, N., Pardoen, T., Raskin, J.-P.

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Fabrication and modeling of 3-D self-assembled SOI MEMS controlled by thermal and plastic strains von Iker, F., Andre, N., Proost, J., Pardoen, T., Raskin, J.P.

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CMOS compatible 3D flow and thermal sensors in SOI technology von Andre, N., Iker, F., Jorez, S., Raskin, J.-P.

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Technology platform for 3-D stacking of thinned embedded dies von Iker, F., Soussan, P., Beyne, E., Baert, K.

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Chip ultra-thinning and embedding technology for autonomous sensors array applications von Muller, P., Iker, F., Soussan, P., Beyne, E., Carchon, G., De Raedt, W.

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3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies von Iker, F., Tezcan, D.S., Teixeira, R.C., Soussan, P., De Moor, P., Beyne, E., Baert, K.

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