Treffer 1 - 4 von 4 für Suche 'Ibe, E.S.', Suchdauer: 0,43s Treffer weiter einschränken
  1. 1
    Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test

    Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test von Ibe, E.S., Loh, K.I., Jing-en Luan, Tong Yan Tee

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  2. 2
    Effect of unfilled underfills on drop impact reliability performance of area array packages

    Effect of unfilled underfills on drop impact reliability performance of area array packages von Ibe, E.S., Loh, K.I., Jing-en Luan, Tong Yan Tee


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  3. 3
    Effect of unfilled underfill on drop test and thermal cycle reliability

    Effect of unfilled underfill on drop test and thermal cycle reliability von Ibe, E.S., Loh, K.I., Jing-en Luan, Tong Yan Tee

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  4. 4
    Analysis of Thermal and Electrical Properties of Laterite, Clay and Sand Samples and Their Effects on Inhabited Buildings in Ota, Ogun State, Nigeria

    Analysis of Thermal and Electrical Properties of Laterite, Clay and Sand Samples and Their Effects on Inhabited Buildings in Ota, Ogun State, Nigeria von Adekunle, A, Ekandem, E S, Ibe, K E, Ananso, G N, Mondigha, E B


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