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  1. 1
    METHOD OF FORMING A CUTOUT OR NOTCH IN A PRINTED CIRCUIT BOARD BY LASER PROCESSING

    METHOD OF FORMING A CUTOUT OR NOTCH IN A PRINTED CIRCUIT BOARD BY LASER PROCESSING von HATA IZUMI, KANAYA YASUHIKO, ISHII KAUHISA

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  2. 2
    Laser processing method for printed substrate and laser processing machine for printed substrate which especially has a damping disposed between the lens and a workpiece for absorbing the energy of the beam

    Laser processing method for printed substrate and laser processing machine for printed substrate which especially has a damping disposed between the lens and a workpiece for absorb... von HATA, IZUMI, SATO, TATSUO, KITA, YASUHIKO, TATEISHI, HIDENORI, ISHII, KAUHISA, ARAI, KUNIO, KANAYA, YASUHIKO

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