Comparisons of various piezoelectric (PZT, LN, PIN-PMN-PT) and asay probes to characterize shock-induced ejection von Imbert, Bruno, Durand, Olivier, Burie, Jean-René, Eveillard, Sébastien, Millier, Philippe

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Aluminum-Germanium Eutectic Bonding for MEMS: Behaviour and Solidification of Liquid Al-Ge on Different Substrates von Lumineau, Victor, Fournel, Frank, Imbert, Bruno, Hodaj, Fiqiri

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Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep von Gondcharton, Paul, Imbert, Bruno, Benaissa, Lamine, Verdier, Marc

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Shaping complex fluids—How foams stand up for themselves von Guillermic, Reine-Marie, Volland, Sabrina, Faure, Sylvain, Imbert, Bruno, Drenckhan, Wiebke

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III-V multi-junction solar cell using metal wrap through contacts von Salvetat, Thierry, Oliva, Eduard, Tauzin, Aurélie, Klinger, Vera, Beutel, Paul, Jany, Christophe, Thibon, Romain, Haumesser, Paul-Henri, Hassaine, Abdelhak, Mourier, Thierry, Rodriguez, Guillaume, Lecouvey, Christophe, Imbert, Bruno, Fournel, Frank, Fabbri, Jean-Marc, Moulet, Jean-Sébastien, Dimroth, Frank, Signamarcheix, Thomas

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Formulation reproducing the ignition delays simulated by a detailed mechanism: Application to n-heptane combustion von Imbert, Bruno, Lafosse, Fabien, Catoire, Laurent, Paillard, Claude-Étienne, Khasainov, Boris

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InP-based composite substrates for four junction concentrator solar cells

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Unorthodox Expenditure Procedures in CEMAC and WAEMU Countries von Selim, Hoda, Suc, Gwenaelle, Imbert, Bruno, Zhao, Qing

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Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Direct Bonding Technology von Di Cioccio, Lea, Radu, Ionut, Baudin, Floriane, Mounier, Angelique, Lacave, Thomas, Delaye, Vincent, Imbert, Bruno, Chevalier, Nicolas, Denis, Mariolle, Gaudin, Gweltaz, Mazen, Frederic, Thieffry, Stephane, Signamarcheix, Thomas

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METHOD FOR DIRECT BONDING von TAUZIN, Aurélie, IMBERT, Bruno

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Evaluation of Titanium Direct Bonding Mechanism von Baudin, Floriane, Delaye, Vincent, Guedj, Cyril, Chevalier, Nicolas, Mariolle, Denis, Imbert, Bruno, Fabbri, Jean-Marc, Di Cioccio, Léa, Bréchet, Yves

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Ignition Delays of Heptane/O2/Ar Mixtures in the 1300-1600 K Temperature Range von Imbert, Bruno, Catoire, Laurent, Chaumeix, Nabiha, Paillard, Claude

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LiNbO 3 Single Crystal Layer Transfer Techniques for High Performances RF Filters von Deguet, Chrystel, Pijolat, Mathieu, Blanc, Nicolas, Imbert, Bruno, Loubriat, Sebastien, Defay, Emmanuel, Ricart, Thibault, Clavelier, Laurent, Moulet, Jean Sebastien, Ghyselen, Bruno, Letertre, Fabrice, Ballandras, Sylvain

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PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMENTS BY DIRECT ADHESIVE BONDING von BENAISSA, Lamine, GONDCHARTON, Paul, MORICEAU, Hubert, IMBERT, Bruno

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PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMENTS BY DIRECT ADHESIVE BONDING von BENAISSA, Lamine, GONDCHARTON, Paul, MORICEAU, Hubert, IMBERT, Bruno

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Direct bonding method von Imbert, Bruno, Tauzin, Aurélie

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METHOD FOR ADHERING A FIRST STRUCTURE AND A SECOND STRUCTURE von BENAISSA, Lamine, GONDCHARTON, Paul, IMBERT, Bruno

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DIRECT BONDING METHOD von TAUZIN, Aurélie, IMBERT, Bruno

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METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS von BENAISSA, Lamine, GONDCHARTON, Paul, IMBERT, Bruno

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DIRECT BONDING PROCESS von TAUZIN, Aurélie, IMBERT, Bruno

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